Bump Height Uniformity And 3D Sensing

Challenges in using traditional methods for measuring uniformity.

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Achieving 3D sensing for semiconductor bump height uniformity is essential before adding photoresist. But there are challenges in using traditional methods for measuring uniformity after copper plating, which requires a combination of 3D fringe projection technology and NanoResolution inspection and metrology.

Here’s what we’ve learned in a bump height uniformity case study:



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