tag: Nordson

Micro Dispensing: From Semiconductors To Sushi
By Muge Deniz Meiller - 11 Jun, 2024 - Comments: 0

The phrase “micro fluid dispensing” is generally associated with applications like medical device assembly or battery manufacturing. It certainly doesn’t conjure up visions of sushi – at least not yet. If engineers at IHI Aerospace and Yamagata University have their way, though, 3D printed sushi will be served to space tourists as they circle in low Earth orbit. Yes, printed sush... » read more

Return On Investment Of A Pre-Reflow AOI System
By Nordson Test And Inspection - 14 May, 2024 - Comments: 0

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate ... » read more

Progress In Wafer And Package Level Defect Inspection
By Anne Meixner - 09 Apr, 2024 - Comments: 0

The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex manufacturing processes. In both wafer and assembly manufacturing, engineering teams have long relied on imaging tools to measure critical features and to inspect for defects after specific pr... » read more

X-ray Inspection In The Semiconductor Industry
By Chris Rand - 12 Mar, 2024 - Comments: 0

With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures and electrical connections in the production of chips have become smaller and smaller. In addition, the sheer number of these connections in a given unit area have also increased in a spectacular way. At the heart of all X-ray inspection, whether it is manual or fully automated metrolog... » read more

Top Tech Videos of 2023
By Liz Allan - 29 Dec, 2023 - Comments: 0

In 2023, heterogeneous integration, RISC-V, and advanced node logic scaling and advanced packaging dominated the semiconductor industry. All of those topics spurred deep discussions at conferences, and they were the subject of Semiconductor Engineering's most popular videos. Of the videos published in 2023, here are the highlights from our five channels: Manufacturing, Packaging & Mater... » read more

Fluid Dispensing For Packaging Today’s Devices
By Nordson Test And Inspection - 12 Dec, 2023 - Comments: 0

Fluid dispensing systems are evolving in order to address the challenges that system-in-package (SiP) and micromechanical systems (MEMS) packages face, especially in regard to tight geometries and assembly processes. These packages, used in smartphones, have become more miniaturized, and as a result, have created added value in the market. However, they include a variety of small dies or dev... » read more

X-ray And Acoustic Inspection
By Nordson Test And Inspection - 07 Nov, 2023 - Comments: 0

X-ray and acoustic imaging are two very complimentary tools for non destructively inspecting the quality of electronics components. Both techniques give information on different aspects of component integrity. Click here to read more of this application note from Nordson's Test and Inspection division.   » read more

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Using Smart Data To Boost Semiconductor Reliability
By Laura Peters - 10 Oct, 2023 - Comments: 0

The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In fact, SEMI estimates its members could capture more than $60B in revenues associated through smart data use and AI. Getting there, however, requires overcoming a number of persistent obstacles. Smart data utilization is... » read more

SiC Growth For EVs Is Stressing Manufacturing
By Anne Meixner - 08 Aug, 2023 - Comments: 0

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

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