tag: Nordson

3D Structures Challenge Wire Bond Inspection
By Karen Heyman - 09 May, 2023 - Comments: 1

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer applications, where the majority of chips are not de... » read more

Case Study – Rohinni Micro LEDs
By CyberOptics - 11 Apr, 2023 - Comments: 0

Rohinni combines vision, execution and micron-scale electronics to make impossible products possible. Using its patented device-placement technologies, Rohinni, together with its joint venture partners, enables bringing innovative products to market in high volumes, and at greatly reduced cost. Click here to read more. » read more

Getting Smarter About Tool Maintenance
By Anne Meixner - 16 Mar, 2023 - Comments: 0

Chipmakers have begun to shift to predictive maintenance for process tools, but the hefty investment in analytics and engineering efforts means it will take some time for smart maintenance to become a widespread practice. Semiconductor manufacturers need to maintain a diverse set of equipment to process the flow of wafers, dies, packaged parts, and boards running through factories. OSAT and ... » read more

Metrology Strategies For 2nm Processes
By Laura Peters - 07 Mar, 2023 - Comments: 3

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are taking on the increasingly 3D nature of structures and the new materials they incorporate. For instance, processes like hybrid bonding, 3D NAND flash devices, and nanosheet FETs are pushing the bo... » read more

New Wafer-Like And Reticle-Like Sensors Deliver Fast, Easy Measurements Inside The Process Chamber
By CyberOptics - 07 Mar, 2023 - Comments: 0

Setup and maintenance operations for semiconductor manufacturing tools can be tedious, time-consuming, and expensive, incurring both direct costs for personnel and resources and indirect costs for lost tool time during extended commissioning of new tools and requalification of repaired or serviced tools. Wafer-like (and reticle-like) sensors (WaferSense® from CyberOptics) provide fast, easy ac... » read more

Effect Of RF Plasma Process Gas Chemistry And Electrode Configuration On The Removal Of Copper Lead Frame Oxidation
By Daniel Chir - 07 Feb, 2023 - Comments: 0

By Daniel Chir and Johnson Toh Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address these issues. However, the effectiveness of plasma treatment for removing oxide is dependent on the correct use of recipe parameters, gas chemistry and electrode conf... » read more

Metrology Options Increase As Device Needs Shift
By Laura Peters - 10 Jan, 2023 - Comments: 1

Semiconductor fabs are taking an ‘all hands on deck’ approach to solving tough metrology and yield management challenges, combining tools, processes, and other technologies as the chip industry transitions to nanosheet transistors on the front end and heterogenous integration on the back end. Optical and e-beam tools are being extended, while X-ray inspection is being added on a case-by-... » read more

Adopting Predictive Maintenance On Fab Tools
By Anne Meixner - 06 Dec, 2022 - Comments: 0

Predictive maintenance, based on more and better sensor data from semiconductor manufacturing equipment, can reduce downtime in the fab and ultimately cut costs compared with regularly scheduled maintenance. But implementing this approach is non-trivial, and it can be disruptive to well-honed processes and flows. Not performing maintenance quickly enough can result in damage to wafers or the... » read more

Legacy Tools, New Tricks: Optical 3D Inspection
By Karen Heyman - 08 Nov, 2022 - Comments: 0

Stacking chips is making it far more difficult to find existing and latent defects, and to check for things like die shift, leftover particles from other processes, co-planarity of bumps, and adhesion of different materials such as dielectrics. There are several main problems: Not everything is visible from a single angle, particularly when vertical structures are used; Various struc... » read more

Bump Height Uniformity And 3D Sensing
By Subodh Kulkarni - 08 Nov, 2022 - Comments: 0

Achieving 3D sensing for semiconductor bump height uniformity is essential before adding photoresist. But there are challenges in using traditional methods for measuring uniformity after copper plating, which requires a combination of 3D fringe projection technology and NanoResolution inspection and metrology. Here’s what we’ve learned in a bump height uniformity case study: » read more

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