category: Everything Low Power

category: IoT, Security & Automotive

Die-To-Die Chiplet Communication
By Paul McLellan - 11 Mar, 2021 - Comments: 0

At CadenceLIVE Americas 2020, one of the most viewed videos was by Samsung Foundry's Kevin Yee and Cadence's Tom Wong, titled "Let’s Talk About Chips (Chiplets), Baby…It’s All About D2D!" They went for this title because it reminded them of the lyrics of an '80s song...which they proceeded to sing. Process and packaging trends Tom led off with a look at the trends in semiconducto... » read more

A New Way To Create Structures
By Tyler Lockman - 11 Feb, 2021 - Comments: 0

Let’s focus today on an established routing technology with a new twist! All of you are doubtless familiar with the concept of structures – formerly called via structures, renamed to structures because of their growing flexibility and application across many flows. These handy, reusable blocks of routing allow you to quickly fan out the most complex of component interfaces. And, after that,... » read more

Imec’s Plan For Continued Scaling
By Paul McLellan - 14 Jan, 2021 - Comments: 0

At IEDM in December, the opening keynote (technically "Plenary 1") was by Sri Samevadam of Imec. His presentation was titled "Towards Atomic Channels and Deconstructed Chips." He presented Imec's view of the future of semiconductors going forward, both Moore's Law (scaling) and More than Moore (advanced packaging and multiple die). It is always interesting to hear Imec's view of the world sinc... » read more

Attaching Fibers To Photonic Chips
By Paul McLellan - 10 Dec, 2020 - Comments: 0

Recently, Cadence held its fifth photonics summit, CadenceCONNECT: Photonics Contribution to High-Performance Computing. You can read my earlier posts: Photonic Integration—From Switching to Computing How to Design Photonics If You Don't Have a PhD: iPronics and Ayar Labs The third day was all about how to connect the incoming and outgoing fibers to the photonics chips. I will cov... » read more

Arm Goes For Performance
By Paul McLellan - 12 Nov, 2020 - Comments: 0

At the recent Linley Processor Conference, Arm presented two processors. This was regarded as so confidential that the original pre-conference version of the presentations didn't contain the Arm one, even though that pdf was only put online about an hour before. But most of the outline of what they presented they already talked about in May, a few months ago. I said recently that this seem... » read more

Testing For Electromagnetic Compliance Without An Anechoic Chamber
By Paul McLellan - 15 Oct, 2020 - Comments: 0

You can't sell an electronic product without getting CE or FCC (or equivalent) certification. In fact, for medical devices and aerospace, the requirements are even stricter. This doesn't just apply to obvious electronic products like laptops or automotive ECUs (electronic control units). It even applies to household goods like washers and dryers. Furthermore, this isn't just some sort of nice-t... » read more

OIP Ecosystem Forum 2020
By Paul McLellan - 10 Sep, 2020 - Comments: 0

Last Tuesday was the virtual TSMC OIP Ecosystem Forum. Apart from being virtual, the format was similar to the usual. Cliff Hou, Senior Vice President of Technology Development, opened the day with a summary of where everything is in the ecosystem around each of the new processes. There were then three keynotes by the leaders of the three big EDA companies. That was followed by more technical ... » read more

Make Acute Angles A Sharp Problem Of The Past
By Tyler Lockman - 13 Aug, 2020 - Comments: 0

Sharp angles, whether they create a spike in a poured shape or form an acid trap between two different pieces of metal, are a problem for us all. As designers, we will go out of our way to try and avoid creating these situations; they will still creep into your design despite the best of intentions. How, then, can you efficiently rid your design of them with the minimal change to your routin... » read more

Enabling Cost-Effective, High-Performance Die-to-Die Connectivity
By Thomas Wong - 09 Jul, 2020 - Comments: 0

System advances in accelerated computing platforms such as CPUs, GPUs and FPGAs, heterogeneous systems on chip (SoCs) for AI acceleration and high-speed networking/interconnects have all pushed chip integration to unprecedented levels. This requires more complex designs and higher levels of integration, larger die sizes and adopting the most advanced geometries as quickly as possible. Facing th... » read more

Models Built With Water
By Paul McLellan - 11 Jun, 2020 - Comments: 0

A couple of years ago I wrote a post using the famous quote by statistician George Box: All Models Are Wrong; Some Are Useful. In that post, I discussed paper and plastic airplanes, but mostly I talked about modeling in computers, and especially what I call the "digital illusion." The digital illusion is the idea that signals in digital chips are ones and zeros, with timing, and not analog vol... » read more

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