High Performance, Multi-Chip Leadframe Package With Internal Connections

By DaeYoung Park - 19 Dec, 2023 - Comments: 0

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip distance (delay), high density I/O counts for multi-function and small form factor [1-3]. With the increasing importance of highly integrated packages, the need for improved thermal management is also... » read more

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

By Gabriel Chang - 16 Nov, 2023 - Comments: 0

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) of solder joints is a widely adapted and stable process in the industry. The applications of MR include flip chip, ball mounting, surface mount technology (SMT), ... » read more

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

By SeokHo Na - 21 Sep, 2023 - Comments: 0

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and experiencing rapid growth. As most of these applications require high performance, single-die Flip Chip packages... » read more

Enabling A Chiplet Supply Chain

By Vik Chaudhry - 17 Aug, 2023 - Comments: 0

Chiplets have been in the news quite a bit lately. A chiplet-based architecture offers several advantages that chip designers can benefit from as they bring out new products to the market. Over the years, system designers have integrated more and more functions into a system on chip (SoC). As a result, the size of SoCs keeps increasing. Even though SoCs provide several advantages in performance... » read more

A Hybrid PLP Technology Based On A 650mm x 650mm Platform

By Eoin O'Toole - 25 Jul, 2023 - Comments: 0

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, multilayer high-density chip-last packages have been introduced for more advanced applications. This technology would also benefit from PL processing for cost reduction. Due to the large package di... » read more

High-Density Fan-Out Packaging With Fine Pitch Embedded Trace RDL

By WonChul Do - 15 Jun, 2023 - Comments: 0

The needs of high-performance devices for artificial intelligence (AI), high performance computing (HPC) and data center applications have drastically accelerated during the Covid-19 pandemic period. At the same time, the integrated circuit (IC) industry struggles to minimize the silicon technology node to satisfy the endless requirements of computing performance within tight cost constraints. ... » read more

Next Gen Laser Assisted Bonding (LAB) Technology

By SeokHo Na - 18 May, 2023 - Comments: 0

In the semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting rapid growth. Among them, CPU data processing, AI and data cloud require much higher power consumption than smart phones or tablets. For the higher power applications, Flip Chip ball grid array (FCBGA) or 2.... » read more

Revising 5G RF Calibration Procedures For RF IC Production Testing

By Vineet Pancholi - 16 Mar, 2023 - Comments: 0

Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) suppliers whose objective is to ensure products are assembled and tested to meet the product test specifications. The growing advancement and demand for RF products for cellphones, navigational instruments, global positioning systems, Wi-Fi, receiver/transmitter (Rx/Tx) componen... » read more

How AiP/AoP Technology Helps Enable 5G And More

By Brendan Wells - 16 Feb, 2023 - Comments: 0

For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These challenges include signal loss, signal integrity, and power supply limitation. Antenna in Package (AiP) and Antenna on Package (AoP) constructions provide the required form, fit and function for high... » read more

An OSAT Perspective On Semiconductor Market Trends

By Vik Chaudhry - 19 Jan, 2023 - Comments: 0

For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

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Knowledge Centers
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