category: Blogs – MD

category: IoT, Security & Automotive

Falling Chip Forecasts
By Mark LaPedus - 20 Jun, 2019 - Comments: 1

It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

Material Solutions For FOWLP Die Shift And Wafer Warpage
By Shelly Fowler - 20 Jun, 2019 - Comments: 0

By Shelly Fowler Today's fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to achieve lower-profile packages without using an inorganic substrate to produce chip packages that are thinner and faster without the need for interposers or through-silicon-via... » read more

New Applications Call For New Memory Types
By Sean SK Kang - 20 Jun, 2019 - Comments: 0

The semiconductor industry is on the verge of a transformative computing era driven by Big Data, Artificial Intelligence (AI) and the Internet of Things (IoT). However, achieving the improvements in computing performance and efficiency needed for new AI and IoT applications represent some of the biggest technology challenges the industry has faced. Among the most critical requirements is del... » read more

Automotive Semiconductors Boost MCU, Analog Markets
By Jim Feldhan - 20 Jun, 2019 - Comments: 0

Auto sales are expected to experience a slowdown in 2019, and even with the continued increase in electronics per vehicle, automotive semiconductor sales are also expected to experience a slowdown. Similar to prior years, 2019/2020 car models will include more automotive semiconductor devices to provide higher degrees of safety, comfort and convenience, driver assist capabilities, in-cabin ente... » read more

SEMI Calls For U.S.-China Tariff Removals
By Jay Chittooran - 20 Jun, 2019 - Comments: 0

In testimony today before a U.S. government interagency panel considering tariffs on $300 billion worth of Chinese goods, SEMI called for the removal of about 30 tariff lines, which cover items central to the semiconductor manufacturing process. Mike Russo, vice president of global industry advocacy at SEMI, explained in his testimony that while SEMI strongly supports efforts to better... » read more

Impact Of U.S.-China Trade War
By Mark LaPedus - 23 May, 2019 - Comments: 0

The trade war between the United States and China is escalating and it is here to stay. Last year, the Trump administration started the trade war with China for basically two reasons. First, China has a massive trade surplus with the U.S. Second, U.S. companies have been the subject of IP theft in China, which has largely gone unchecked, according to the Trump administration. Many disagre... » read more

Challenges And Solutions For Silicon Wafer Bevel Defects During 3D NAND Flash Manufacturing
By Pradeep Nanja - 23 May, 2019 - Comments: 0

As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between the wafer center and the wafer edge. Industry participants are working to reduce defect density at the wafer edge to improve overall wafer yield. Attention has focused on common wafer bevel defects s... » read more

Multifunctional Materials Enable Single-Layer Temporary Bonding And Debonding
By Luke Prenger - 23 May, 2019 - Comments: 0

Many new wafer-level packaging (WLP) technologies involve the processing of thin wafers that must be mechanically supported during the manufacturing flow. These technologies include fan-out wafer-level packaging (FOWLP), fan-in wafer-level chip-scale packaging (FI-WLCSP), 3-D FOWLP, 2.5-D integration with interposer technology, and true 3-D IC integration using through-silicon via (TSV) interco... » read more

Q1 2019 Unit Drop Impacts Wafer Demand For 2019
By Joanne Itow - 23 May, 2019 - Comments: 0

The Semico Wafer Demand Model update for Q1 2019 now results in a 5.9% decline in wafer demand for 2019. Along with process technology and productivity, Semico’s Wafer Demand Model is highly dependent on semiconductor unit sales. In the Q1 2019, total semiconductor units dropped by 7.4% compared to Q4 2018 and 3.8% compared to Q1 2018. The drop in units is significant because of the broad spe... » read more

Small Critical Subsystems Suppliers Outperform In Downturns
By Julian West - 23 May, 2019 - Comments: 0

Clouds continue to persist over the semiconductor supply chain with little sign of lifting. In March, the decline in week-over-year chip sales appeared to be slowing, providing a glimmer of hope for the beginning of a new cycle. However, the recent rapid escalation of the tariff war between the U.S. and China heaped more uncertainty on the industry and visibility continues to remain low. Rev... » read more

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