category: Blogs – MD

category: IoT, Security & Automotive

Exploring The Fundamentals Of Photolithography
By Joyce Lowes - 23 May, 2024 - Comments: 0

In the semiconductor materials industry, photolithography is a crucial technology for creating intricate electronic circuits. Essentially, it’s the art of printing at the nanoscale level, enabling the precise patterning of semiconductor materials. The ability to do this well is important for companies in the industry because it determines how detailed and efficient microchips can be. This aff... » read more

Navigating The Talent Crunch: AI Solutions For A Thriving Semiconductor Manufacturing Sector
By David Park - 23 May, 2024 - Comments: 0

The CHIPS and Science Act is a historic piece of legislation passed by the US government in 2022 aimed at regaining American leadership in semiconductor manufacturing. Supported by an unprecedented $52 billion in federal funding, this investment will also address supply chain vulnerabilities and national security concerns that were made glaringly public by the COVID epidemic. In addition to ... » read more

A Wrap-Up Of Photomask Japan 2024
By Ingo Bork - 23 May, 2024 - Comments: 0

This year, I had the opportunity to attend the 30th Symposium on Photomask and NGL Mask Technology, also called Photomask Japan 2024 (PMJ), in Yokohama, Japan, from April 16 to 18. This well-regarded symposium brings together engineers from all over the world to share ideas on photomasks, NGL masks and related technologies. It was great being back to an in-person conference after four years ... » read more

Accelerating Innovation With An E-Beam Lithography System
By Al Blais - 23 May, 2024 - Comments: 0

By Al Blais and Johnny Yeap Traditional lithography remains a standard in the industry, providing precision and a relatively cost-effective way to create patterns on the wafer when producing very high volumes of chips. However, cycle times can be long depending on the complexity of the masks that must be made. The emergence of maskless e-beam lithography is providing a complementary path ... » read more

Sparking Climate Action With Earth Month Lightning Talks
By Wojtec Osowiecki - 23 May, 2024 - Comments: 0

In the age of rapidly advancing technology and global connectivity, it’s essential to recognize the impact of our actions on the planet. As industries evolve, so must our commitment to sustainability and environmental stewardship. In this spirit, the Climate Equity and Social Impact (CESI) working group, part of the SEMI Sustainability Initiative, last month hosted the semiconductor industry... » read more

Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing
By Prasad Dhond - 18 Apr, 2024 - Comments: 0

Automotive processors are rapidly adopting advanced process nodes. NXP announced the development of 5 nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5 nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3 nm processes in 2023 [3]. In the past, the automotive industry was slow to adopt the latest semiconductor technologies due to reliability conc... » read more

Enabling New Applications With SiC IGBT And GaN HEMT For Power Module Design
By Shela Aboud - 18 Apr, 2024 - Comments: 0

The need to mitigate climate change is driving a need to electrify our infrastructure, vehicles, and appliances, which can then be charged and powered by renewable energy sources. The most visible and impactful electrification is now under way for electric vehicles (EVs). Beyond the transition to electric engines, several new features and technologies are driving the electrification of vehicles... » read more

Exploring Process Scenarios To Improve DRAM Device Performance
By Yu De Chen - 18 Apr, 2024 - Comments: 0

In the world of advanced semiconductor fabrication, creating precise device profiles (edge shapes) is an important step in achieving targeted on-chip electrical performance. For example, saddle fin profiles in a DRAM memory device must be precisely fabricated during process development in order to avoid memory performance issues. Saddle fins were introduced in DRAM devices to increase channel l... » read more

Advanced Packaging Design For Heterogeneous Integration
By CP Hung - 18 Apr, 2024 - Comments: 0

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, edge AI and autonomous electrical vehicles, traditional chips are transforming i... » read more

eBeam Initiative Marks Major Milestones Over 15 Years Of Photomasks And Lithography
By Jan Willis - 18 Apr, 2024 - Comments: 0

The eBeam initiative celebrated its 15th anniversary at the recent SPIE Advanced Lithography + Patterning Conference. 130 members of the mask and lithography community attended the annual lunch to mark the milestone. The eBeam Initiative welcomed its 53rd member, FUJIFILM Corporation, having grown from 20 members and advisors at its launch. FUJIFILM is the first company from the chemical supply... » read more

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