category: Blogs – MD

category: IoT, Security & Automotive

5 Takeaways From BACUS
By Mark LaPedus - 22 Sep, 2016 - Comments: 0

As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithography... » read more

Will III-V Power Devices Happen?
By Ben Lee - 22 Sep, 2016 - Comments: 0

In a previous blog post, I provided a review of the overall power device market and trends driving changes in device evolution that entail materials innovation. For the industry to make such a shift, the advantages over mature, low-cost silicon technologies must be compelling and something the industry absolutely has to implement. Now I’d like to focus on new materials offering competitive be... » read more

The Pitfalls Of Auto-Stitching In Double-Patterning
By David Abercrombie - 22 Sep, 2016 - Comments: 0

Ever since the first double-pattern (DP) odd-cycle error ring was produced on a layout, designers have longed for a magic solution to solve it. Traditionally, the first approach to fixing an odd-cycle error was to move a polygon or a polygon edge to increase spacing to an adjoining polygon in the cycle. Alternatively, you could remove a polygon altogether, or split it into two pieces. All of th... » read more

Design Process Technology Co-Optimization For Manufacturability
By Dalong Zhao - 22 Sep, 2016 - Comments: 0

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. Meeting yield and product cost targets is a continuous challenge, due to new device structures and increasingly complex process innovations introduced to achieve improved product performance at each new technology node. Design for manufacturability (DFM) and design process technology... » read more

NextFlex Takes High Profile With Events And First Round Of Project Announcements
By Heidi Hoffman - 22 Sep, 2016 - Comments: 0

NextFlex, FlexTech’s flexible hybrid electronics (FHE) manufacturing institute, has been headlining flexible electronics in a major way in the past few weeks. From hosting contingents from the White House and the Pentagon, Members of Congress and local dignitaries, to announcing new development projects and partners, this one-year old organization is off to a rapid start while highlighting ad... » read more

Changing Economics In Chip Manufacturing
By Ed Sperling - 18 Aug, 2016 - Comments: 1

The foundry and equipment businesses are poised for significant changes that could affect the balance of power far beyond just the semiconductor manufacturing sector. It’s no secret that the number of companies developing new chips at 7nm is shrinking. There will be even fewer at 5nm. The business case for moving forward is that density must provide a competitive edge. But that density imp... » read more

Trade War Looms Over Materials
By Mark LaPedus - 18 Aug, 2016 - Comments: 1

It’s time to pay close attention to rare earths and raw materials--again. In fact, the supply chain teams and commodity buyers at aerospace, automotive and electronics companies may have some new and potentially big problems on their hands. For some time, the European Union (EU), the United States and other nations have been at odds with China over rare earths. China, which accounts for... » read more

Fins And Wires – How Do We Get To 5nm?
By Mike Chudzik - 18 Aug, 2016 - Comments: 0

As the industry moves beyond 10nm to the 7nm and 5nm nodes, fundamental shifts are needed to address scaling challenges. Among the priority concerns driving industry changes, particularly with respect to materials and architecture, is the impact on transistor performance from rising parasitic resistance and parasitic capacitance or RC. I spoke about this industry dilemma recently at the SEMICON... » read more

Device Pin-Specific Property Extraction For Layout Simulation
By Phil Brooks - 18 Aug, 2016 - Comments: 0

As we work through the sub-20 nm design space, the interactions between and effects on devices that are near each other are becoming critical factors in achieving the desired electrical performance. Accurate extraction of device pin-specific properties for modelling these effects is essential to attaining design goals. LVS extraction challenges Layout vs. schematic (LVS) comparison tools prov... » read more

Making Phones Better
By Mattan Kamon - 18 Aug, 2016 - Comments: 0

Beneath a smartphone's slick packaging is some interesting, highly sophisticated technology that makes the user experience what it is today. Much of that experience relies on satisfying our ever growing desire for more data capacity for video, social media and the like. Providing that capacity relies on robust filtering to receive just your data stream amongst many nearby other streams. But tha... » read more

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