Semiconductor Process Development: Finding A Faster Way To Profitability

By Katherine Gambino - 20 Feb, 2017 - Comments: 0

Building a chip fabrication facility requires billions of dollars in investment for land, buildings, processing equipment, chemical and hazardous material safety, not to mention the deployment of hundreds of highly experienced process engineering and manufacturing personnel. Bringing up an advanced semiconductor process in any fab, new or established, is a several-hundred-million dollar effort,... » read more

Integrating Process Models With TCAD Simulation…

By Jacky Huang - 23 Jan, 2017 - Comments: 2

Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, and their effect on a novel device, prior to physical fabrication. Process modeling is a technique that can predict the 3D structure of a device using an understanding of unit process steps. Durin... » read more

BEOL Barricades Ahead

By David Fried - 15 Dec, 2016 - Comments: 0

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. Among the questions posed to panelists: What is BEOL? Where does it begin and end? Are there fundamental limits to interconnect processes? How much longer can we continue to use current interconnect processes and ... » read more

Bringing Advanced Semiconductor Manufacturing Technologies To Higher Education

By Jimmy Gu - 17 Nov, 2016 - Comments: 0

Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. Recently, Coventor’s predictive, 3D proce... » read more

Achieving The Vision Of Silicon Photonics Processing

By Sandy Wen - 20 Oct, 2016 - Comments: 0

With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable. Copper cabling cannot keep up with the upcoming data center bandwidth requirements for applications such as multimedia streaming and high performance computing. One technology that could enable true optical communication is silicon photonics. Silicon is ... » read more

Design Process Technology Co-Optimization For Manufacturability

By Dalong Zhao - 22 Sep, 2016 - Comments: 0

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. Meeting yield and product cost targets is a continuous challenge, due to new device structures and increasingly complex process innovations introduced to achieve improved product performance at each new technology node. Design for manufacturability (DFM) and design process technology... » read more

Making Phones Better

By Mattan Kamon - 18 Aug, 2016 - Comments: 0

Beneath a smartphone's slick packaging is some interesting, highly sophisticated technology that makes the user experience what it is today. Much of that experience relies on satisfying our ever growing desire for more data capacity for video, social media and the like. Providing that capacity relies on robust filtering to receive just your data stream amongst many nearby other streams. But tha... » read more

Pattern Dependence Process Modeling

By Joseph Ervin - 21 Jul, 2016 - Comments: 0

First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” prior to actual fabrication. In some instances, a deeper level of complexity needs to be added to the process model to capture the effects of variation in the process. Specific examples inclu... » read more

IMEC Partner Technical Week Review

By Aurélie Juncker - 23 Jun, 2016 - Comments: 0

In March 2016, Coventor was invited to the biannual Partner Technical Week (PTW) at IMEC in Leuven, Belgium. IMEC, a world-leading research group in nanotechnology, organizes their Partner Technical Week every six months to present scientific results to their partners. During this week, a number of specialists from IMEC's many partner companies also discuss their progress in areas related to IM... » read more

Toward Better Acoustic Resonators

By Mattan Kamon - 19 May, 2016 - Comments: 0

After some lively conversations with the top researchers in MEMS acoustic resonators during the 2014 Sensors and Actuators Workshop (familiarly known to the MEMS community as “Hilton Head”), we set to work on a simulation solution to better serve researchers and commercial designers. Acoustic resonators for RF filtering have received a lot of attention in the past few years as the number... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Perfecting The Process

category: IoT, Security & Automotive