category: Blogs – PTES

category: IoT, Security & Automotive

Measuring Multi-Layer Ultra-Thin Critical Films
By Jiangtao Hu - 11 Mar, 2025 - Comments: 0

Artificial intelligence is one of the driving forces in today’s semiconductor industry, with more traditional market drivers like high performance compute and smart phones continuing to play important roles. This situation is unlikely change in the years ahead as chip makers continue their quest to create the most advanced nodes. With 3nm nodes in production and 2nm nodes on the horizon, the ... » read more

Speeding Down Memory Lane With Custom HBM
By Faisal Goriawalla - 11 Mar, 2025 - Comments: 0

With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data rates. Over the last decade, the High Bandwidth Memory (HBM) protocol has proven to be a popular choice for data center and high-performance computing (HPC) applications. Even more benefit can be rea... » read more

Unlocking The Value Of Yield
By Marc Hutner - 11 Mar, 2025 - Comments: 0

Have you stopped to consider the impact of yield on your overall product cost? Of course you did, when you considered your yield targets and set your product goals. But is it good enough to stop once the goals are achieved, or should you find ways to drive additional value into your organization once production has begun? What is the value of a 1% improvement in product yield? The short answer ... » read more

Silicon Photonics Raises New Test Challenges
By Jeorge Hurtarte - 11 Mar, 2025 - Comments: 0

Semiconductor devices continuously experience advancements leading to technology and innovation leaps, such as we see today for applications in AI high-performance computing for data centers, edge AI devices, electric vehicles, autonomous driving, mobile phones, and others. Recent technology innovations include Angstrom-scale semiconductor processing nodes, high-bandwidth memory, advanced 2.5D/... » read more

AI Semiconductors Require An Integrated Test Solution
By Ira Leventhal - 11 Mar, 2025 - Comments: 0

The rapid proliferation of generative pre-trained transformers based on large language models (LLMs) is driving growth in the market for chips that can run the LLMs and other artificial intelligence (AI) and machine learning (ML) applications. Several types of chips hold promise for accelerating AI computing. Graphical processing units (GPUs) have proven to be capable solutions for the server/c... » read more

Innovations Driving The Advanced Packaging Roadmap: Part Two
By Keith Best - 11 Feb, 2025 - Comments: 0

As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume manufacturing. In last month’s blog, “Innovations Driving The Advanced Packaging Roadmap: Part One,” we discussed the challenges of organic and glass substrates as the industry marches toward sub-2µm ... » read more

Transformational Opportunities Coming To Semiconductor Manufacturing
By John Kibarian - 11 Feb, 2025 - Comments: 0

During the GSA US Executive Forum in September 2024, a panel discussion brought together Marco Chisari, EVP from Samsung Semiconductor, Jeff Howell, Global VP for High Tech at SAP, and John Kibarian, CEO of PDF Solutions. The purpose of the discussion was to compare and contrast the perspectives from one of the largest global semiconductor companies with that of the most widely used enterpri... » read more

Hyperconvergence Of Design For Test And Physical Design
By Sri Ganta - 11 Feb, 2025 - Comments: 0

By Sri Ganta and Hyoung-Kook Kim In today’s highly competitive semiconductor industry, chip-design companies strive for competitive advantages by optimizing designs for PPA (Power, Performance, Area). Along with the functional logic, design cores also comprise DFT (Design for Test) logic that spreads across the design. The DFT logic also must be optimized for PPA, requiring design implemen... » read more

Early Detection Of C-RES Degradation On High-Current Power Planes
By Brent Bullock - 11 Feb, 2025 - Comments: 0

Probe-card or device contactor damage can be dramatic and catastrophic, with yield dropping drastically very quickly. What is not dramatic is the hypothesized slow probe needle or contactor degradation process that might precede catastrophic failure. Such degradation is difficult to detect in the early stages, when probe cards, die, and packages continue to yield normally. A key goal is to dete... » read more

Innovations Driving The Advanced Packaging Roadmap: Part One
By Keith Best - 14 Jan, 2025 - Comments: 1

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to ... » read more

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