Innovations Driving The Advanced Packaging Roadmap: Part One


Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to ... » read more

Semiconductor Manufacturing’s Transformational Challenges


Semiconductor manufacturing is going through massive transformational challenges driven by strong demand for advanced computing, fueled by AI, cloud, the electrification of the economy, and the need for compute power in data centers to support these applications. With the slowdown of Moore’s Law, more compute power will not be achieved by just increasing transistor density. Not only is Moo... » read more

Industry Standards For Chiplets And Their Role In Test


As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the technologies necessary to respond and innovate, but to keep the industry running smoothly, we need effective collaboration, and that demands standardization. Source: Arizona State University There ... » read more

Expanding The Horizon Of System Monitoring With The Arm SMCF


In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are committed to enabling advanced diagnostics, predictive maintenance, and on-chip actionable visibility for today’s mission-critical systems, across high-performance industries. Our in-chip monitori... » read more

Experiences Estimating Test Quality And Test Escape Rates


When discussing product quality in integrated circuits (ICs), two key aspects are essential: time zero defects and reliability. These concepts help distinguish between issues that appear immediately after manufacturing and those that occur over time. Understanding these distinctions is critical for ensuring that products meet the quality demands of their respective markets, particularly in h... » read more

No-Compromise Packetized Test Improves DFT Efforts


Design for Test (DFT) managers often must make difficult and sometimes costly trade-offs between test implementation effort and manufacturing test cost. The traditional method for evaluating these trade-offs has been to use hierarchical DFT methods in a divide-and-conquer approach. In hierarchical DFT efforts, all implementation, including pattern generation and verification, is done at the cor... » read more

Semiconductor Test Faces Technology Shifts In The AI Era


The surge in data-rich applications shows no signs of slowing down, fueling significant evolution within the global semiconductor industry. This insatiable demand for data necessitates a comprehensive ecosystem involving sensors and systems to capture data, networks to transmit it, and storage and processing power to analyze it. Successful deployment of these applications relies on the devel... » read more

Understanding Test Quality In Semiconductor Devices: An Overview


When it comes to semiconductor device testing, the primary goal is to ensure that each device meets functional and performance specifications. Testing also plays a crucial role in confirming that products will work as intended in real-world applications. However, defects in the manufacturing process can be a hindrance, making testing an essential step for quality assurance. Why test matters: F... » read more

Shift Left Strategy For Semiconductor Production Testing


In the fast-paced world of semiconductor manufacturing, achieving higher yields and reducing costs are constant challenges. Ideally, yield should only be impacted by unavoidable defects when everything else is performing as expected. However, when yield reduction occurs due to the process sensitivity of the design, these issues can be detected and, in many cases, corrected. proteanTecs has d... » read more

AI Predictive Modeling Tools Move Into Critical Role To Leverage AI, ML


The semiconductor industry, as always, is at the forefront of transformational technological innovation, driving escalating complexity of manufacturing processes that extend time-to-market delivery, inflate research and development costs, and lead to expensive delays when problems arise. As manufacturers navigate these challenges, the need for comprehensive prediction of manufacturing proble... » read more

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