category: Blogs – PTES

category: IoT, Security & Automotive

Using Picosecond Ultrasonic Technology For AI Packages: Part 2
By Cheolkyu Kim - 10 Jul, 2025 - Comments: 0

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve tremendous performance gains. However, the heterogeneous integration of advanced packages has its own set of process control obstacles that must be addressed, including new interconnect challenges invol... » read more

GenAI’s Breakneck Pace Is Reshaping The Semiconductor Industry
By Alex Burlak - 10 Jul, 2025 - Comments: 0

Humankind is witnessing a technological revolution so extreme that its full magnitude might extend beyond the scope of our intellect. Generative AI (GenAI) is doubling its performance every six months [1], outpacing Moore's law in what the industry calls Hyper Moore's Law. Some cloud AI chipmakers expect to double or triple performance every year for the next ten years [2]. In this three-part b... » read more

Testing At The Speed Of Light: Enabling Scalable Optical Testing For Silicon Photonics And CPO
By Matthew Griffin - 10 Jul, 2025 - Comments: 0

Today, a single ChatGPT query consumes roughly ten times more power than a traditional Google search and will only continue to grow as AI extends to image and video generation. With this growth not only in AI, but also in cloud computing and high-performance computing (HPC), data center electricity consumption is projected to account for up to 9.1% of total U.S. electricity use by 2030. ... » read more

Addressing Silicon Lifecycle Scaling Demands
By Marc Hutner - 10 Jul, 2025 - Comments: 0

In today’s competitive business landscape, navigating complexity can be a decisive advantage, but it also presents significant challenges. Three crucial trends driving the rise of complexity are technology scaling, design scaling and system scaling. Traditionally, Design for Test (DFT) solutions have focused on the die level; however, these challenges present opportunities at the package and ... » read more

On-chip Monitor Analytics Scales With Silicon Chip Production From NPI Through HVM
By Guy Cortez - 10 Jul, 2025 - Comments: 0

By Guy Cortez and Dan Alexandrescu At the New Product Introduction (NPI) stage of silicon chip production, product engineers work with a limited but critical dataset – typically from initial silicon samples or engineering lots – enabling early assessment of the power and performance of your silicon. Analytics solutions typically have no time-to-results (TTR) issues when the volume of dat... » read more

Harnessing The Power Of Data To Remain Competitive
By Jonathan Holt - 10 Jul, 2025 - Comments: 0

The semiconductor industry operates at the forefront of technological innovation, even as manufacturers face constant pressure to improve production yields, manage intricate supply chains, reduce costs and accelerate time to market. Businesses have learned to harness the power of data to optimize decision-making and streamline operations to remain competitive by using PDF Solutions' Exensio ... » read more

The Data Dilemma In Semiconductor Testing And Why It Matters: Part 2
By Roberto Colecchia - 10 Jul, 2025 - Comments: 0

In Part 1, we explored the challenges of implementing machine learning and real-time analytics in semiconductor testing—chiefly, the difficulty of transferring device test data across multiple locations and organizations. In this post, we introduce Data Feed Forward (DFF) as it applies to ACS Advantest. What is ACS DFF? ACS DFF is a cloud-enabled solution designed to simplify, secure... » read more

Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
By Cheolkyu Kim - 10 Jun, 2025 - Comments: 0

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the front-end of the process. In other words, the technologies that were once exclusively deployed in the first part of the process are being used to meet the increasingly stringent requirements of ad... » read more

In-System/In-Field Testing Using High-Quality Deterministic Test Patterns
By Ashrith Harith - 10 Jun, 2025 - Comments: 0

The amount of electronic content in passenger cars is growing rapidly, primarily due to the integration of advanced safety features. The shift towards fully autonomous vehicles, which must comply with stringent safety standards, will further increase the number of electronic components required. Testing efforts must be of exceptional quality. The target test time is often limited to less than 1... » read more

Tackling Advanced Chip Manufacturing Challenges
By Christophe Begue - 10 Jun, 2025 - Comments: 0

Intel and PDF Solutions are deepening their partnership to address the growing complexity of semiconductor manufacturing at advanced nodes, according to a recent discussion between Intel CEO Lip-Bu Tan and PDF Solutions CEO John Kibarian at the Direct Connect Intel Foundry event in April. During the presentation, Kibarian highlighted how the two companies have been collaborating for approxim... » read more

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