category: Intelligent Innovation

category: IoT, Security & Automotive

Addressing The ABF Substrate Shortage With In-Line Monitoring
By Wesley Chou - 08 Mar, 2022 - Comments: 1

Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – an electrical insulator designed for complex circuits – are found in PCs, routers, base stations, and servers. Looking ahead, the ABF substrate market will continue to grow, with revenue up ... » read more

Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology
By Nick Keller - 08 Feb, 2022 - Comments: 1

As 3D NAND continues to scale vertically — all in the name of increasing capacity and speed and reducing inefficiency and cost — maintaining channel hole critical dimension (CD) and shape uniformity becomes even more challenging. Faced with rising high-aspect ratios, addressing these challenges requires new inline non-destructive metrology to provide real-time process control. Infrared crit... » read more

Extreme Ancestry: Silicon Edition
By Mike McIntyre - 11 Jan, 2022 - Comments: 0

The ability to trace the genealogy of all the components in an electronic device has been getting more complex for decades. For many industries — automotive, defense, medical and others — the need to locate the source of a problem in near real-time is paramount to gauging the extent of that problem. The extreme case is when the issue occurs with a product that already has been distributed a... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Advanced Modeling In FTIR Offers New Applications For HVM
By Benoit Ravot - 09 Nov, 2021 - Comments: 0

In the leading high-volume manufacturing (HVM) process flows, materials-enabled scaling has increased inline applications for compositional metrology. A previous blog discussed how Fourier transform infrared (FTIR) spectroscopy was used for inline composition measurements. These measurements informed advanced process control for the wafer-level processing of selectively etched 3D NAND wordli... » read more

Strategies For Meeting Stringent Standards For Automotive ICs
By Prasad Bachiraju - 26 Oct, 2021 - Comments: 0

It may surprise you, but when it comes to chips in electronic braking systems, airbag control units, and more, automotive manufacturers are still using 10-year-old technology — and with good reason. For the automotive industry, the reliability, stability, and robustness of electronic components are critical, especially when it comes to meeting the stringent Automotive Electronics Council (... » read more

In The Spotlight: What Is Responsible For The Surging Demand For CIS?
By Woo Young Han - 07 Sep, 2021 - Comments: 0

After TSMC announced plans to construct a new fab in Arizona, the Taiwan-based company disclosed that they are considering building new fabs in Japan and Germany. While the Arizona fab will focus on producing 5nm nodes using extreme ultraviolet lithography (EUV) technology, the new plant in Japan reportedly would focus on the 28nm node. This 28nm fab in Japan would be in addition to a 28nm fab ... » read more

Reducing Rework In CMP: An Enhanced Machine Learning-Based Hybrid Metrology Approach
By Vamsi Velidandla - 10 Aug, 2021 - Comments: 0

By Vamsi Velidandla, John Hauck, Zhuo Chen, Joshua Frederick, and Zhihui Jiao The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) steps has increased and, with it, a greater need for within-wafer uniformity and wafer-to-wafer control of the thin... » read more

What Does It Take To Build A Successful Multi-Chip Module Factory?
By Mike McIntyre - 06 Jul, 2021 - Comments: 0

When it comes to multi-chip module (MCM) manufacturing, fan-out wafer-level and fan-out panel-level packaging have received a lot of coverage recently. Every week, it seems like there is an announcement about “Company XYZ” moving their products into the fan-out wafer-level packaging (FOWLP) or fan-out panel-level packaging (FOPLP) space. But these moves come with challenges that didn’t ex... » read more

Expanded Material Metrology For Refined Etch Selectivities
By Anoop Somanchi - 08 Jun, 2021 - Comments: 0

Trends in advanced device fabrication require combined lithography-etching multi-patterning sequences and self-aligned multi-patterning to form devices’ finest features at subwavelength dimensions. As EUV lithography (13.5 nm) progresses to larger numerical apertures and new thin resists, new multipatterning sequences must be developed with mutually compatible resists and proximal layers t... » read more

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