category: Blogs – PTES

category: IoT, Security & Automotive

Automotive Applications Demand Silicon Lifecycle Management
By Pawini Mahajan - 08 Nov, 2022 - Comments: 0

Every electrical engineer learns early in university studies that automobiles are a highly demanding environment for electronics. Temperature and humidity extremes, noise and vibration, electrical interference, exposure to alpha particles, and other factors all make it hard to design and manufacture chips that will operate properly under all conditions. These challenges are exacerbated as chips... » read more

Bump Height Uniformity And 3D Sensing
By Subodh Kulkarni - 08 Nov, 2022 - Comments: 0

Achieving 3D sensing for semiconductor bump height uniformity is essential before adding photoresist. But there are challenges in using traditional methods for measuring uniformity after copper plating, which requires a combination of 3D fringe projection technology and NanoResolution inspection and metrology. Here’s what we’ve learned in a bump height uniformity case study: » read more

Simplifying The Path From Design To Test
By Richard Fanning - 08 Nov, 2022 - Comments: 0

By Richard Fanning and John Rowe Getting an integrated circuit (IC) from design to test is an arduous process that encompasses a number of steps, including: Design for Test (DFT): processes that ensure the chip is designed in such a way that it can be tested Development: the development of automated test programs (ATPs) Bench: evaluating the device at the bench to ensure the desig... » read more

Optimizing Vmin With Path Margin Monitors
By Ash Patel - 24 Oct, 2022 - Comments: 0

By Firooz Massoudi and Ash Patel Choosing the right operating voltage for various digital blocks within a semiconductor device is one of the most important tasks faced by chip designers. Operating voltage has major effects on performance, power consumption, and reliability. Increasing the voltage generally increases performance, but at the cost of more power and higher lifetime operating cos... » read more

Heterogeneous Integration: Exposing Large Panels With Fewer Shots
By John Chang - 11 Oct, 2022 - Comments: 0

By John Chang, with Corey Shay, James Webb, and Timothy Chang The More than Moore era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, heterogeneous integration is one tool helping accomplish these gains by combining multiple silicon nodes and designs inside one pac... » read more

The Future Of Connectivity Is Higher Data Rates And Micro-Positioning
By David Vondran - 11 Oct, 2022 - Comments: 0

These days, we tend to take global wireless connectivity for granted. Whether we’re in a coffee shop, a hotel room, or a plane at 35,000 feet, chances are that we’ll be able to enjoy Internet access at reasonable speeds. But despite this constant connectedness, we still manage to misplace our keys and forget where we left our smartphones. New connectivity technologies are promising to ha... » read more

Hunting For Macro Defects: The Importance Of Bare Wafer Inspection
By Aseem Srivastava - 08 Sep, 2022 - Comments: 0

As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading silicon wafer manufacturer estimates that 50% of epitaxial wafer supply for logic will be on nodes equal to or less than 7nm. This is up approximately 30% from earlier in the decade. To meet the demands of extreme ultraviol... » read more

Test Data Streaming For The Next Generation Of Designs
By Rahul Singhal - 08 Sep, 2022 - Comments: 0

Semiconductor chips have been evolving to meet the demands of rapidly transforming applications, and so has the test technology to meet the test goals of those chips. Going back two decades or so, the applications were limited and the designs were simpler, thus the concerns about power, performance and area (PPA), turn-around time, re-use and time-to-market, etc., were important but not as crit... » read more

The Future Of Wireless Test Is Over The Air
By David Vondran - 08 Sep, 2022 - Comments: 0

The deployment of mmWave technology is synonymous with 5G rollout and the initial results for faster links are amazing. For example, using a mmWave band, the prospects of a 1-2 Gbps link means a typical HD movie can download in less than a minute. An upload link of 30 Mbps also enables the transfer of videos back to the cloud at a record pace. These user experiences are enabled by the antenna l... » read more

KLA Publishes 2021 Global Impact Report And Shares New Climate Goals
By John McLaughlin - 08 Sep, 2022 - Comments: 0

KLA is publishing its latest Global Impact Report, detailing progress of our environmental, social and governance (ESG) programs, results and commitments from the past year. Managing our ESG impact is an important part of our mission to advance humanity through devices and ideas that transform our world and help shape a better future for generations to come. “Our accomplishments in 2021 w... » read more

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