category: Blogs – PTES

category: IoT, Security & Automotive

AI Semiconductors Require An Integrated Test Solution
By Ira Leventhal - 11 Mar, 2025 - Comments: 0

The rapid proliferation of generative pre-trained transformers based on large language models (LLMs) is driving growth in the market for chips that can run the LLMs and other artificial intelligence (AI) and machine learning (ML) applications. Several types of chips hold promise for accelerating AI computing. Graphical processing units (GPUs) have proven to be capable solutions for the server/c... » read more

Innovations Driving The Advanced Packaging Roadmap: Part Two
By Keith Best - 11 Feb, 2025 - Comments: 0

As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume manufacturing. In last month’s blog, “Innovations Driving The Advanced Packaging Roadmap: Part One,” we discussed the challenges of organic and glass substrates as the industry marches toward sub-2µm ... » read more

Transformational Opportunities Coming To Semiconductor Manufacturing
By John Kibarian - 11 Feb, 2025 - Comments: 0

During the GSA US Executive Forum in September 2024, a panel discussion brought together Marco Chisari, EVP from Samsung Semiconductor, Jeff Howell, Global VP for High Tech at SAP, and John Kibarian, CEO of PDF Solutions. The purpose of the discussion was to compare and contrast the perspectives from one of the largest global semiconductor companies with that of the most widely used enterpri... » read more

Hyperconvergence Of Design For Test And Physical Design
By Sri Ganta - 11 Feb, 2025 - Comments: 0

By Sri Ganta and Hyoung-Kook Kim In today’s highly competitive semiconductor industry, chip-design companies strive for competitive advantages by optimizing designs for PPA (Power, Performance, Area). Along with the functional logic, design cores also comprise DFT (Design for Test) logic that spreads across the design. The DFT logic also must be optimized for PPA, requiring design implemen... » read more

Early Detection Of C-RES Degradation On High-Current Power Planes
By Brent Bullock - 11 Feb, 2025 - Comments: 0

Probe-card or device contactor damage can be dramatic and catastrophic, with yield dropping drastically very quickly. What is not dramatic is the hypothesized slow probe needle or contactor degradation process that might precede catastrophic failure. Such degradation is difficult to detect in the early stages, when probe cards, die, and packages continue to yield normally. A key goal is to dete... » read more

Innovations Driving The Advanced Packaging Roadmap: Part One
By Keith Best - 14 Jan, 2025 - Comments: 1

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to ... » read more

Semiconductor Manufacturing’s Transformational Challenges
By John Kibarian - 14 Jan, 2025 - Comments: 0

Semiconductor manufacturing is going through massive transformational challenges driven by strong demand for advanced computing, fueled by AI, cloud, the electrification of the economy, and the need for compute power in data centers to support these applications. With the slowdown of Moore’s Law, more compute power will not be achieved by just increasing transistor density. Not only is Moo... » read more

Industry Standards For Chiplets And Their Role In Test
By Jeorge Hurtarte - 14 Jan, 2025 - Comments: 0

As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the technologies necessary to respond and innovate, but to keep the industry running smoothly, we need effective collaboration, and that demands standardization. Source: Arizona State University There ... » read more

Expanding The Horizon Of System Monitoring With The Arm SMCF
By Ziv Paz - 14 Jan, 2025 - Comments: 0

In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are committed to enabling advanced diagnostics, predictive maintenance, and on-chip actionable visibility for today’s mission-critical systems, across high-performance industries. Our in-chip monitori... » read more

Experiences Estimating Test Quality And Test Escape Rates
By Ken Butler - 14 Jan, 2025 - Comments: 0

When discussing product quality in integrated circuits (ICs), two key aspects are essential: time zero defects and reliability. These concepts help distinguish between issues that appear immediately after manufacturing and those that occur over time. Understanding these distinctions is critical for ensuring that products meet the quality demands of their respective markets, particularly in h... » read more

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