Is Advanced Packaging The Next SoC?

Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Xcerra: Back to the Drawing Board

It’s been nearly two weeks since Xcerra and Hubei Xinyan Equity Investment Partnership announced they have terminated their merger agreement in the face of apparent opposition by the Committee on Foreign Investment in the United States, the federal interagency panel that reviews transactions for their impacts on national security. Xcerra and Hubei Xinyan also withdrew their CFIUS application.... » read more

5G New Radio Signal Design

By Gent Paparisto, Joel Kirshman, and David Vye The CP-OFDM modulation scheme will have many options. Variable subcarrier spacing (SCS) will be 3.75, 15, 30, 60, 120, 240, 480 kHz with sub-1 GHz of 15 and 30 kHz and sub-6 GHz of 15, 30, and 60 kHz, and above 6 GHz of 60 and 120 kHz. There will be normal and extended CP options. Slot duration will be 0.5 ms, subframe curation will be 1 ms, an... » read more

Better Living Through Microelectronics

The recently completed 2018 Winter Olympic Games left many of us in awe of the athleticism on display. But this month’s 2018 Winter Paralympic Games, also being held in PyeongChang, South Korea, could be an even more impressive showcase of both skills and heart. Competitors from around the world will include athletes with a range of physical, intellectual and visual disabilities. Of course, t... » read more

What’s In The Package?

Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

ATE Tailwind For 2018?

The automatic test equipment market enjoyed a record sales year during 2017, and there are indications that the good times will continue this year. Forecasters are predicting another robust year for sales of DRAMs and NAND flash memory devices, especially 3D NAND. That will drive demand for memory test equipment to keep up. Frost & Sullivan predicts semiconductor test equipment will h... » read more

Walk A Mile In Their Shoes

To most of us, when we think about how artificial intelligence (AI) enhances our mobility, the most top-of-mind examples might be how our smart phones respond to voice commands when we ask for directions to the nearest coffee shop or the current weather at the location to which we’re heading. But for people missing limbs, AI has the potential to give them the mobility that they might never ha... » read more

System-Level Simulation Of Technologies Supporting Enhanced Spectral Efficiency For 5G New Radio

By Gent Paparisto, Joel Kirshman, and David Vye 5G New Radio (5G NR) is the wireless standard defining the next generation of mobile networks. 5G will offer higher capacity than current 4G, enabling a higher density of mobile broadband users and supporting device-to-device and massive-machine communications. 5G research and development will support lower latency, improved reliability, and... » read more

5G Makes Its Public Debut At The Winter Games

We have been spending considerable time and effort with our customers deep in the development of technology that will enable next-generation communications. Work on 5G technology has been underway for several years now-long before the general public will experience its amazing capabilities. So when will this next-generation technology be ready? You'll get a first look next month at the Winte... » read more

Advanced Packaging Still Not So Simple

The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

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