Paving The Way To Autonomous Driving


Over the past couple weeks, four major carmakers began pairing off to jointly develop autonomous vehicles. Numerous reports say Ford will sign a deal with Volkswagen, and BMW is working on Level 4 self-driving vehicles with Daimler, the parent of Mercedes Benz. While this speaks volumes about the enormous cost of developing artificial intelligence systems to drive vehicles, it also points th... » read more

Challenges Of Logic BiST In Automotive ICs


The electronics in passenger cars continues to grow, and much of it is bound by the strict functional safety requirements formalized in the ISO 26262 standard. The ICs that drive the electronics systems in automobiles are also increasingly complex, designed to execute artificial intelligence algorithms that govern emerging self-driving capabilities. Designers are quickly adopting comprehensi... » read more

Practical Ways To Reduce Test Time


If someone said that paper never refused ink, they could have said the same about test programs and tests. Early on in my career as a test development engineer, I commented out all tests except the key test for the new product I was working on. This allowed me to isolate the test and fix its repeatability. The next pre-production run finished much earlier than I expected and I was impressed ... » read more

Deprocessing And SEM For Semiconductor Failure Analysis


A typical semiconductor is fabricated from metal and barrier layers separated by passivation layers. A further glassivation and/or polyimide layer on top of these provides environmental and mechanical protection. Optical microscopes By using optical microscopy, the semiconductor die can be inspected for failure modes such as top-down visible crack degradation, melt-down of metal conductors,... » read more

Manufacturing ADAS Cameras Calls For Analytics


Automotive camera design and manufacturing is one of the most difficult undertakings in hardware. Not only do you need to deal with the usual difficulties of high performance mechanical and electrical designs, but now highly specialized and sensitive optics are added into the equation. Complicating factors is that you won’t know how good the product is until it’s been completely assembled, ... » read more

Highlights From The Automotive Testing Expo 2019


Thousands of automotive engineers and enthusiasts visited the Automotive Testing Expo in Stuttgart, Germany, in May to see nearly 500 companies show off their latest technologies to test features such as active safety, vehicle electrification, and connectivity, among others. This blog features highlights of the expo and the Autonomous Vehicle Test and Development Symposium held in conjunction w... » read more

Thinking Differently About IIoT Analytics


Manufacturers are rushing to keep up with the latest technology trends and perhaps the most significant ones are around the smart factory. Whether you call it Industry 4.0, Smart Manufacturing or the Industrial Internet of Things (IIoT), what all these initiatives have in common is the desire to maximize value from manufacturing data and improve overall manufacturing efficiency. With the ave... » read more

Test Moving Forward And Backward


Test, once considered an important but rather mundane way of separating good chips from the not-so-good and the total rejects, is taking on a whole new life. After decades of largely living in the shadows behind design and advancements in materials and lithography, test has quietly shifted into a much more critical and more public role. But it has taken several rather significant shifts acro... » read more

Smart Plug-And-Play DFT For Arm Cores


Modern SoCs are experiencing continued growth in capabilities and design sizes with more and more subsystem IPs being implemented. These large, complex, multi-core SoCs need strategies for DFT and ATPG that effectively reduce DFT effort, minimize ATPG runtime, and still achieve the target test coverage. Hierarchical DFT enables designing and testing of these designs in a systematic and repeatab... » read more

Failure Analysis Of Electronic Devices Using Scanning Acoustic Microscopy


Scanning acoustic microscopy, or SAM, is a non-destructive technique used in failure analysis of complex devices. SAM can provide a resolution down to sub-micron thicknesses. SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. This can be used e.g. for investigations of sealing, coating, flip-chip underfills, BGA, QFN, wafer to wafer ... » read more

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