The Need for Speed


We’ve previously identified the convergence occurring between surface mount technologies (SMT), used to connect packaged semiconductor devices on printed circuit boards, and advanced packaging (AP) technologies, in which connections between the semiconductor devices and to the outside world are incorporated in the packaging process using front-end-like, wafer-or panel-based manufacturing proc... » read more

Sensors, Data And Machine Learning


Strategies for building reliability into chips and systems are beginning to shift as more sensors are added into these devices and machine learning is applied to that data. In the past, system monitoring relied heavily on MEMS devices for things like acceleration, temperature and positioning (gyroscopes). While those devices are still important, in the past couple years there has been an exp... » read more

Home Analysis Of STDF Data


STDF data files can be very large, often tens of megabytes, sometimes over a gigabyte for a single file. When you’re working from home and only have a desktop tool for analysis, you’ll have to download the data first from your work network. Even if the files are compressed first, they are still large and many times you would be required to analyze dozens of data files to really understand a... » read more

Heating Up Cryogenic Wafer Testing


The use of on-wafer superconducting materials, other novel materials, and traditional semiconductors at cryogenic temperatures (below about 123K, or -150°C) has grown quickly in recent years. Inventive new sensors take advantage of unique material properties at very low temperatures to detect a wide variety of physical phenomena such as infrared radiation, magnetic fields, x-rays, and more. T... » read more

Redefining Device Failures


Can a 5nm or 3nm chip really perform to spec over a couple decades? The answer is yes, but not using traditional approaches for designing, manufacturing or testing those chips. At the next few process nodes, all the workarounds and solutions that have been developed since 45nm don't necessarily apply. In the early finFET processes, for example, the new transistor structure provided a huge im... » read more

The Convergence Of Advanced Packaging And SMT


One statement is almost always true in the electronics industry: smaller is better. The relentless demand for electronic systems that pack more computing power and functionality into less space has driven the development of new processes and designs since the invention of the integrated circuit. In recent years that drive has taken a new direction, literally, as manufacturers have discovered th... » read more

Lessons In Monitoring System Performance


At proteanTecs, we set out to revolutionize electronics with a breakthrough approach to address the challenges that come with scale: Deep Data monitoring of the health & performance of systems, from design to field. Knowledge and education are profoundly rooted in our core values. However, as the circumstances of COVID-19 unfold, we are following the guidelines of the World Health Organi... » read more

Benefits And Drawbacks Of Working From Home


Many people are working home in recent weeks, due to the current Coronavirus (Covid-19) crisis.  At yieldHUB, a good number of us have worked remotely or from a home office for years. We have people working like this in Taiwan, the USA, the UK and Ireland. As well as that, our software system enables semiconductor engineers and their managers to work remotely or from home. There are many be... » read more

Service Agreements For Probe Systems


Having a Probe Systems Service Agreements can bring simplicity and peace of mind when it comes to keeping equipment operating at optimum performance. We take the guesswork out of maintenance budgeting by providing parts and labor coverage at a single, low cost. Priority service and part delivery eliminates time wasted waiting for maintenance or repair parts. Comprehensive, scheduled preve... » read more

Test Is Becoming A Horizontal Process


Semiconductor test, once a discrete part of a well-orchestrated series of manufacturing steps, is looking more like a process that extends from the early concept stage in design to the end of life of whatever system that chip ultimately is used for. This has important ramifications for safety-critical markets in general, and the semiconductor industry in particular. Both worlds have been inc... » read more

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