A Different Approach To Failure Analysis


Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require the die to be exposed. Different package types with changing sizes and bonding types such as Au- and Cu-bonded packages for unmounted and PCBA-mount components were successfully achieved. A combin... » read more

Chips That See


An opto-based microchip implemented in standard CMOS technology has made it possible to develop a new type of on-chip functionality which combines normal ASIC technology with optical filters on the chip diode. The chip emulates the human eye and the way it detects light can be used for industrial purposes to create artificial intelligence for functions such as 3D motion control, eye protection ... » read more