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Failure Analysis Of Electronic Devices Using Scanning Acoustic Microscopy


Scanning acoustic microscopy, or SAM, is a non-destructive technique used in failure analysis of complex devices. SAM can provide a resolution down to sub-micron thicknesses. SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. This can be used e.g. for investigations of sealing, coating, flip-chip underfills, BGA, QFN, wafer to wafer ... » read more

A Different Approach To Failure Analysis


Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require the die to be exposed. Different package types with changing sizes and bonding types such as Au- and Cu-bonded packages for unmounted and PCBA-mount components were successfully achieved. A combin... » read more