Radar Transceivers: How To Connect The Antennas

By Marta Martinez Vazquez - 07 Sep, 2023 - Comments: 0

There are different antenna options for transmitting and receiving a radar signal. This blog will focus on how to connect a monolithic microwave integrated circuit (MMIC) radar transceiver to the antennas in a way that guarantees an efficient transfer of the signals. mmWave MMIC to antenna interfaces At millimeter-wave (mmWave) frequencies, any transitions between two different transmission l... » read more

Semiconductor Industry Is Pulling AI Across A Diversity Of End Uses And Applications

By Sailesh Chittipeddi - 03 Aug, 2023 - Comments: 0

Earlier this month, I had the pleasure of joining a group of industry peers during SEMICON West and the Design Automation Conference in San Francisco for an enlightening panel discussion that we organized titled, “How AI Is Reinventing the Semiconductor Industry Inside and Out.” Moderated by Gartner, I was joined on the panel by senior executives from Advantest, Synopsys and the TinyML Foun... » read more

Reducing Noise Issues In Microcontroller Systems: Part 1

By Graeme Clark - 22 Jun, 2023 - Comments: 0

In my ideal digital world, of which I often dream, signal voltage margins are always positive, signal timing margins are always positive, power supply voltages are always within the operating voltage range, and our environment is completely benign. Unfortunately, none of us live in this ideal world, no matter how much I would like to. The real world is dirty and noisy, and the power distribu... » read more

Connectivity Challenges In Industry 4.0

By Kayoko Nemoto - 25 May, 2023 - Comments: 0

Industry 4.0 is characterized by interoperability (such as IIoT), information transparency (digital plant models: virtual copy of physical world), technical support (the ability of cyber-physical systems to support humans by executing various tasks), and decentralized decision-making. IIoT allows devices to be connected, creating a virtual copy of real-world data that allows operators to visual... » read more

Improved DSP And AI Performance On An MCU Core

By Eldar Sido - 27 Apr, 2023 - Comments: 0

In the world of embedded devices, there's a growing demand for advanced machine learning and signal processing capabilities. ARM Cortex-M85, the latest general-purpose core, aims to meet these demands with its 32-bit Armv8.1-M architecture, offering high performance and power efficiency. The core's Helium technology, M-profile vector extension (MVE), provides significant uplift for ML/DSP appl... » read more

The I3C Interface Can Help Improve Performance In Sensor Applications

By Graeme Clark - 23 Mar, 2023 - Comments: 0

The I3C interface (officially the “MIPI Alliance Improved Inter Integrated Circuit”) was initially developed by the MIPI Alliance to support sensor interconnect in mobile applications. The MIPI Alliance is a global alliance of electronics companies that develop technical specifications for mobile applications, of which Renesas Electronics is a member. The original concept behind the I3C ... » read more

Smart Energy Metering For A Greener Future

By Toshio Kimura - 23 Feb, 2023 - Comments: 0

One of the key ways we will realize a sustainable future is to optimize—and essentially reduce—our energy usage. Optimization starts with understanding how much energy we consume every day. And to understand this, we must measure the power we consume in everyday applications. The smart meter is an important tool to help us transition to a “greener” use of energy. What is a smart ene... » read more

The New Convergence: IoT, AI, And 5G Bring Actionable Intelligence To The Factory Floor

By Sailesh Chittipeddi - 26 Jan, 2023 - Comments: 0

Last year, I reflected on the Renesas Renaissance in terms of how our long-term growth strategy is positioning the company as a full-spectrum, global technology solutions provider with an extended physical footprint in the U.S., Europe, and China. Thanks to the acquisitions of Intersil, IDT, Dialog Semiconductor, and Celeno we now have expansive design capabilities that surround our embedded... » read more

Enable Application Design Without Considering Device Configuration

By Satoshi Kubota - 21 Dec, 2022 - Comments: 0

The software-defined vehicle, which defines in-vehicle value through software, requires new applications to be deployed in a variety of vehicle models. To achieve this, developers need a solution that allows them to easily develop applications without considering device configuration in the ECU and to take maximum performance of the hardware. However, there are currently issues (figure 1). W... » read more

AI At The IoT Edge Is Disrupting The Industrial Market

By Sailesh Chittipeddi - 22 Nov, 2022 - Comments: 0

Artificial intelligence (AI) at the edge of the network is a cornerstone that will influence the future direction of the technology industry. If AI is an engine of change, then semiconductors are the oil driving the new age that is being defined by machine learning (ML), neural networks, 5G connectivity and the advent of blockchain, digital twins and the metaverse. Despite recent disruptions... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: At The Edge

category: IoT, Security & Automotive