Optimizing System-Level Connectivity In Heterogenous Automotive Packages

By Keith Felton - 04 Nov, 2021 - Comments: 0

By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

How Verification And Validation Can Create A Comprehensive Digital Twin To Design Tomorrow’s Self-Driving Cars Today

By Shakeel Jeeawoody - 07 Oct, 2021 - Comments: 0

By Shakeel Jeeawoody and Hieu Tran Autonomous vehicles (AV) are the future of driving – and the future might not be so far away. Optimizing the capabilities of self-driving vehicles and the environment around them could lead to a mad dash to the financial finish line for manufacturers. Who takes the checkered flag will ultimately be determined by the efficiency and cost-effectiveness of th... » read more

High-Quality Test And Embedded Analytics Are Vital For Secure SoCs

By Lee Harrison - 02 Sep, 2021 - Comments: 0

Applications such as smart cards and devices used in the defense industry require security features to ensure that sensitive data is inaccessible to outside agents. This used to be a niche requirement met through custom solutions. However, now that automotive and cyber-physical systems are proliferating, the requirements around secure test and monitoring are becoming mainstream. The current bes... » read more

Building A More Secure SoC

By Gajinder Panesar - 05 Aug, 2021 - Comments: 1

SoC integrators know that a software-only chip security plan leaves devices open to attack. All that a hacker needs to do is find a way to replace key parts of the bootloader or the low-level firmware to compromise other software in the system used to support secure access. The most simple attacks come remotely over a network, and these can be patched with software upgrades. However, we see ... » read more

‘Hug The Debug’ – Before It’s Too Late

By Sumit Vishwakarma - 01 Jul, 2021 - Comments: 0

Though the term “shift-left” originated in the software industry, its importance is often cited in the hardware (semiconductor) industry where the end-product (chip) costs are skyrocketing. The increase in cost is driven by a global chip shortage, especially in the automotive industry. Manufacturing a robust chip is a long, iterative process that may require many re-spins. Shift-left refers... » read more

Three Steps To ISO 26262 Fault Campaign Closure

By Jacob Wiltgen - 03 Jun, 2021 - Comments: 0

The complexity of automotive ICs continues to grow exponentially, challenging even the most veteran teams to deliver innovative products to market while simultaneously ensuring safety through the operational life of the product. This is the purpose of safety verification. Its primary objective is to understand whether the safety architecture sufficiently prevents random failures from violati... » read more

Circuit Reliability Verification For Automotive Electronics

By Matthew Hogan - 06 May, 2021 - Comments: 0

By Matthew Hogan and Dina Medhat In the automotive industry, reliability and high quality are key attributes for electronic automotive systems and controls. Naturally, they are particularly crucial when developing functional safety (FuSa) solutions, where inadequate performance or product failure can lead to injury or death. When it comes to safety-related automotive electronics, ISO 26262 p... » read more

Protecting The Connected Automobile From Modern-Day Cyberattacks

By Ahmed Majeed Khan - 01 Apr, 2021 - Comments: 0

As the industry continues to make advances in the autonomous vehicle as well as in vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications, automotive OEMs must do everything possible to protect the connected automobile from potential cyberattacks. Unfortunately, attacks have become so prevalent, regulatory agencies are now defining cybersecurity requirements. New laws are b... » read more

Over-the-Air Automotive Updates

By Lee Harrison - 04 Mar, 2021 - Comments: 0

Modern vehicles are increasingly-connected devices with growing volumes of electronic systems. This systemic complexity means that even an average vehicle design will include over 150 ECUs, which control not just infotainment and communications, but powertrain, safety, and driving systems (figure 1). We see not just a surge in the volume and complexity of electronic hardware, but also software.... » read more

Four Steps To Resolving Reset Domain Crossing Data-Corruption In Automotive SoCs

By Kurt Takara - 04 Feb, 2021 - Comments: 0

By Kurt Takara (Siemens EDA), Ankush Sethi (NXP), and Aniruddha Gupta (NXP) Modern automotive SoCs typically contain multiple asynchronous reset signals to ensure systematic functional recovery from unexpected situations and faults. This complex reset architecture leads to a new set of problems such as possible reset domain crossing (RDC) issues. Conventional clock domain crossing (CDC) veri... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Building The IoE

category: IoT, Security & Automotive