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2.5/3D IC Reliability Verification Has Come A Long Way


2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a passive silicon interposer. The interposer is placed on a ball grid array (BGA) organic substrate. Micro-bumps attach each die to the interposer, and flip-chip (C4) bumps attach the interposer to the ... » read more

Cutting Clock Costs On The Bleeding Edge Of Process Nodes


In a recent study done by McKinsey and IDC, we see that physical design and verification costs are increasing exponentially with shrinking transistor sizes. As figure 1 shows, physical design (PD) and pre-silicon verification costs are doubling each process leap. As companies leap from node to leading node, a natural question arises. Why is it becoming harder and more expensive to tapeout a chi... » read more

A Look Inside RF Design


RF EDA continues pushing the boundaries for today’s complex system designs. Connected workflows are creating shift left opportunities for engineering in virtual space. RF and microwave architects and designers can accelerate design and verification with powerful electromagnetic (EM) modeling and simulation technology. In the webinar for the 2023 launch of PathWave Advanced Design System (ADS)... » read more

ML And UVM Share Same Flaws


A number of people must be scratching their heads over what UVM and machine learning (ML) have in common, such that they can be described as having the same flaws. In both cases, it is a flaw of omission in some sense. Let's start with ML, and in particular, object recognition. A decade ago, Alexnet, coupled with GPUs, managed to beat all of the object detection systems that relied on tradit... » read more

TCAD-Based Radiation Modeling Technique For Reliable Aerospace Chips


By Ian Land and Ricardo Borges We demand a lot from the electronic components that bring our devices and systems to life. This is particularly true when it comes to semiconductors for space applications. From satellites to spacecraft, aerospace and defense equipment must tolerate the most extreme of operating conditions in order to perform their jobs safely and reliably. How do you ensure... » read more

Radar For Automotive: Basics Of FMCW Radar


Radar (acronym for Radio Detection and Ranging) uses radio waves to detect objects in the environment. It allows determining the distance (known as range), angular position (bearing), and velocity. Radar technology was developed for military use during World War II, but has now many civil applications, including air or marine traffic control, astronomy, ocean and meteorological monitoring, alti... » read more

DAC 2022: Is It Too Risky Not To Adopt RISC-V?


I was fortunate enough to attend the 59th Design Automation Conference (DAC) in San Francisco. Aside from the Covid closure in 2020 I’ve been going to DAC since 1995. Many people, including me, arrived to San Francisco with a bit of trepidation. After all, 58th DAC had low attendance and it was only about 7 months ago. What was the DAC 2022 conference going to be like? How would Covid affec... » read more

Digital Transformation At The Farnborough Airshow 2022


Alternating every year with the Paris Airshow, the Farnborough Airshow was back to an in-person event this July 2022. It focused on six key themes—space, defense, sustainability, innovation, future flight, and workforce. Within these themes, digitalization and data emerged as very prominent messages. Some of the prototypes and actual devices on display at the event felt like they were taken s... » read more

Memory Evolution Drives Requirements For Design Technology Co-Optimization


By Ricardo Borges and Anand Thiruvengadam As new technology nodes have become available, memory has been one of the most aggressive semiconductor applications to adopt advanced process technology. The relentless demand by users of electronic devices for more memory has ensured that investments in new nodes and processes would be quickly repaid by massive sales volumes. As each new node came ... » read more

IMS2022 Booth Tour: EDA And Measurement Science Converge


At the IEEE MTT-S International Microwave Symposium (IMS) 2022, the theme was “Explore the Peaks of Microwave Engineering,” a play on the event’s Denver location. There’s another clever interpretation – exploring the peaks encountered in high peak-to-average power ratio (PAPR) conditions with complex modulation. These modulated signals are driving Keysight’s vision where EDA and dig... » read more

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