Why Is The Power Device Market So Hot Right Now?


Growing adoption of electric vehicles (EVs) and renewable energy sources is putting the spotlight on power semiconductor devices. These power devices have always been essential in determining the efficiency of a variety of systems, from small household electronics to equipment used in outer space. But as calls to reduce carbon emissions get louder, the market for these chips continues to flouri... » read more

TSMC Reports 4Q2023 Earnings: N2 Still On Track For 2025 Production


TSMC reported their 4th quarter and end of year financial numbers for 2023. Year over year, net revenue was down 4.5% to NT$2,161.74 billion, but quarter over quarter revenue was essentially flat at NT$625.52 billion, so it appears that as 3nm is ramping up that revenue is improving. For the fourth quarter, 3nm contributed 15% of TSMC’s total wafer revenue, up from 6% in the third quarter ... » read more

Optimizing IP Management For Chiplet-Based Designs


Chiplets are making big waves in the semiconductor industry, with its global market size growing at 71.3% from 2023 to 2031. Through heterogeneous integration of multiple components of different nodes and technologies, design teams are reinvigorating Moore’s law and paving the way for designs featuring multi-billion transistors and hundreds of IP blocks. These chiplet-based designs are a... » read more

Can Data Centers Afford To Turn Up The Heat?


Typically, when we discuss digital twin software for data centers, we highlight how engineers can use data center software to model complex thermals using physics-based simulation and find effective ways to cool IT equipment. However, there are compelling efficiency and cost-saving reasons for data center operators to actively seek to run their data centers hotter. But how can this be done wit... » read more

Top500: Frontier Still On Top, Sunway Formally Reappears


New versions of the Top500 and Green500 lists have been released, and Frontier continues its reign at Number. 1. But a newcomer, Aurora, using Intel’s Sapphire Rapids, has entered at the Number 2 position with a “half-scale” system. Both machines are HPE Crays, with the former using AMD optimized third-gen EPYC 64C at 2.0GHz and AMD Instinct MI250X, while the latter uses Intel Xeon CPU... » read more

What You Needed To Know In 2023


I always use the last blog of the year to review everything published in the Systems & Design and Low Power – High Performance channels of Semiconductor Engineering, the two channels that I write for. It is useful to see what interests you and, as I have found in the past, it is an indicator of where the industry is going. You read about the issues you are facing as designers, and you nee... » read more

Balancing Memory And Coherence: Navigating Modern Chip Architectures


In the intricate world of modern chip architectures, the "memory wall" – the limitations posed by external DRAM accesses on performance and power consumption growing slower than the ability to compute data – has emerged as a pivotal challenge. Architects must strike a delicate balance between leveraging local data reuse and managing external memory accesses. While caches are critical for op... » read more

Shedding More Light On Photonics For Multi-Die Systems


By Kenneth Larsen and Twan Korthorst Photonics harness the speed of light for fast, low-power, high-capacity data transfer. A tremendous amount of data needs to be moved swiftly across different components in a multi-die system. Considering this, exploiting the advantages of light is one way to mitigate heat dissipation and energy consumption concerns while delivering fast data transmission.... » read more

Extending DTCO For Today’s Competitive IC Landscape


As semiconductor components continue to shrink, the challenges associated with design-for-manufacturing (DFM) and design-technology co-optimization (DTCO) increase. The complexity of the IC design and manufacturing process demands an extension of traditional DFM and DTCO techniques to overcome the systematic failures tied to complex design-process interactions. Designers need to accelerate d... » read more

Unraveling PCIe 6.0 Loopback And Digital Near-End Loopback Feature


The PCIe specification has given a specific Link Training and Status State Machine (LTSSM) state named Loopback, which is intended for test and fault isolation use. Basically, it gives a mechanism that involves looping back the data that was received in the Loopback LTSSM state. The entry and exit behavior are specified, and all other details are implementation-specific. Loopback can op... » read more

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