category: Blogs – SLD

category: IoT, Security & Automotive

RISC-V Verification: From Simulation To Formal
By Ashish Darbari - 27 Jun, 2024 - Comments: 0

Axiomise's Nicky Khodadad and Ashish Darbari discuss simulation and the need for formal verification and RISC-V, including why simulation-based verification is inadequate to find all the bugs in a design and how formal verification can help with bug hunting for corner-case bugs and exhaustive proofs of bug absence. » read more

Navigating The Future Of EDA
By Anika Sunda - 27 Jun, 2024 - Comments: 0

The landscape of electronic design automation (EDA) is undergoing a monumental transformation. The catalysts? Artificial Intelligence (AI) and Machine Learning (ML). These technological marvels are not just reshaping how we approach design and verification in electronics; they are redefining the possibilities within the field. Our latest podcast episode delved deep into this topic, uncovering t... » read more

The Fundamentals Of Software Testing
By Jonathon Wright - 27 Jun, 2024 - Comments: 0

Recently, I had a conversation with Paul Gerrard, the internationally renowned, award-winning software engineering consultant, author, and coach. We discussed the fact that testing is at the heart of software development. Obviously, as testers, we spend all day testing and thinking about testing. But developers test every line of code they write. Sometimes, users test. In fact, the all-perva... » read more

Streamlining SoC Design With Advanced IP And Integration Solutions
By Andy Nightingale - 27 Jun, 2024 - Comments: 0

As system-on-chip (SoC) complexity grows, so does the necessity for products that seamlessly connect IP and streamline integration processes, minimize manual errors, and enhance productivity. The emphasis on physical awareness across solutions significantly reduces the iterative cycles of NoC placement and routing. By ensuring low latency and high efficiency, these advanced integration solution... » read more

Enabling 2.5D/3D Multi-Die Package
By Kenneth Larsen - 27 Jun, 2024 - Comments: 1

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets (also knowns as dies) into a single package, demands not only a new level of IC design innovation but also an increased complexity in coordination and integration. At the forefront of this technolo... » read more

Ensuring Your Power And Ground Nets Are Correctly Connected
By Terry Meeks - 03 Jun, 2024 - Comments: 0

In most chip designs, the power and ground nets are likely your largest and most important nets. If any devices are not properly connected, then you cannot expect them to function as expected. Amongst the many problems that can occur to power and ground involves the connections to the well areas of your design that power all the bulk connections to your devices. Well regions connectivity is oft... » read more

DAC Panel Could Spark Fireworks
By Brian Bailey - 30 May, 2024 - Comments: 1

Panels can often become love fests. While a title may sound controversial, it turns out that everyone quickly finds that all the panelists agree on the major points. This is sometimes the result of how the panel was put together – the proposal came from one company, and they wanted to get their customers or clients onto the panel. They are unlikely to ask a major competitor to be part of the ... » read more

Vision Is Why LLMs Matter On The Edge
By Ben Gomes - 30 May, 2024 - Comments: 0

Large Language Models (LLMs) have taken the world by storm since the 2017 Transformers paper, but pushing them to the edge has proved problematic. Just this year, Google had to revise its plans to roll out Gemini Nano on all new Pixel models — the down-spec’d hardware options proved unable to host the model as part of a positive user experience. But the implementation of language-focused mo... » read more

Turbocharging Cost-Conscious SoCs With Cache
By John Min - 30 May, 2024 - Comments: 0

Some design teams creating system-on-chip (SoC) devices are fortunate to work with the latest and greatest technology nodes coupled with a largely unconstrained budget for acquiring intellectual property (IP) blocks from trusted third-party vendors. However, many engineers are not so privileged. For every “spare no expense” project, there are a thousand “do the best you can with a limited... » read more

AI-Powered Data Analytics To Revolutionize The Semiconductor Industry
By Reela Samuel - 30 May, 2024 - Comments: 1

In the age where data reigns supreme, the semiconductor industry stands on the cusp of revolutionary change, redefining complexity and productivity through a lens crafted by artificial intelligence (AI). The intersection of AI and the semiconductor industry is not merely an emerging trend—it is the fulcrum upon which the next generation of technological innovation balances. Semiconductor comp... » read more

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