Inaccurate Assumptions Mean Software Issues


It doesn’t seem that long ago when features and functionality were being added to next generation processors and SoCs ahead of demand. Actually, I recall when new processors were released, embedded software developers were forced to think of innovative ways to exploit the new features in order to differentiate the product to not be left behind. Today, in many respects it seems as if the... » read more

The Rapid Rise Of RISC-V


The first RISC-V Summit, which took place last month in Santa Clara, CA, appears to be a watershed for the RISC-V ecosystem. The technology is maturing and the ecosystem is growing fast – and that was reflected in the nature of the presentations and news announcements we saw. The accent has started to move to how the technology will be used in real life. UltraSoC’s announcement of a har... » read more

A Conference For The Ages


The International Solid-State Circuits Conference (ISSCC) was held recently in its permanent location at the San Francisco Marriott Marquis. eSilicon had the honor of both presenting our SerDes capabilities and demonstrating the technology as well. More about that later. First, I’d like to examine the institution called ISSCC. The first ISSCC was held in 1954 in Philadelphia. Yes, 1954, that�... » read more

ISO 26262:2018, 2nd Edition: What Changes?


If you’re involved somehow in design for automotive electronics, you probably have more than a cursory understanding of the ISO 26262 standard. What your organization is working from is most likely the 2011 definition. The most recent update is formally known as ISO 26262:2018, less formally as ISO 26262 2nd Edition. Figure 1. Overview of the ISO 26262:2018 series of standards (Source IS... » read more

Will Top-Down Hardware/Software Co-Design Ever Happen?


Hardware/software co-design has been talked about, and predicted to be a problem, for at least two decades now. Why has the hardware/software development world not come to an end? In 1999, Wilf Corrigan—LSI Logic’s CEO at the time—said that the most pressing need for new EDA tools was a better methodology that would “allow software developers to begin software verification more near the... » read more

Connectivity Checking Is A Perfect Fit For Formal Verification


Formal verification has traditionally been regarded as an advanced technique for experts to thoroughly verify individual blocks of logic, or perhaps small clusters of blocks. However, if you talk to anyone involved in the field these days, you’ll find that the majority of formal users are running applications (“apps”) targeted for specific verification problems. Further, many of these app... » read more

MISing In Signoff


Timing signoff is critical to ensure your design will perform as expected before it is taped out. For many designs, signoff and subsequent ECOs are focused on the performance target and iterating to meet that.  Once the performance goals are met then the attention passes onto hold-time fixing and then, usually, quickly onto tapeout.  However, even after extensive signoff analysis, silicon fai... » read more

Verifying AI Designs Thoroughly And Quickly


You can’t turn around these days without seeing a reference to AI – even as a consumer. AI, or artificial intelligence, is hot due to the new machine-learning (ML) techniques that are evolving daily. It’s often cited as one of the critical markets for electronics purveyors, but it’s not really a market: it’s a technology. And it’s quietly – or not so quietly – moving into many, ... » read more

High-Speed Communication Takes A Village


Supply chain, partner network, ecosystem. There are a lot of ways to describe the collection of companies needed to get something done. We’ve all discussed the extensive ecosystem needed to get an advanced chip designed and built. Without a doubt, that is a formidable problem addressed by a sophisticated team of companies. I’d like to take it up a notch in this discussion, however. What abo... » read more

AI Chips: NoC Interconnect IP Solves Three Design Challenges


New network-on-chip (NoC) interconnect IP is now available for artificial intelligence (AI) systems-on-chip (SoC). Arteris IP launched the fourth generation of the FlexNoC interconnect IP with a new optional AI package. The novel NoC interconnect technologies solves many data flow problems in today’s AI designs. Innovative features address the requirements of the next-generation of AI chips t... » read more

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