category: Low Power-High Performance

category: IoT, Security & Automotive

Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
By Cadence - 08 Nov, 2023 - Comments: 0

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process. The Cadence Celsius Thermal Solver integrated within the Cadence IC, pac... » read more

Research Bits: November 6
By Jesse Allen - 06 Nov, 2023 - Comments: 0

Fast superatomic semiconductor Researchers from Columbia University created a fast and efficient superatomic semiconductor material based on rhenium called Re6Se8Cl2. Rather than scattering when they come into contact with phonons, excitons in Re6Se8Cl2 bind with phonons to create new quasiparticles called acoustic exciton-polarons. Although polarons are found in many materials, those in Re6Se... » read more

Research Bits: October 24
By Jesse Allen - 24 Oct, 2023 - Comments: 0

Photonic-electronic hardware processes 3D data Researchers from the University of Oxford, University of Muenster, University of Heidelberg, and University of Exeter are developing integrated photonic-electronic hardware capable of processing three-dimensional data, which the team claims boosts data processing parallelism for AI tasks. The researchers added an extra parallel dimension to the... » read more

Research Bits: October 17
By Jesse Allen - 17 Oct, 2023 - Comments: 0

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

Memory Technologies Key To Advancing AI Applications
By Tim Messegee - 12 Oct, 2023 - Comments: 0

Memory is an integral component in every computer system, from the smartphones in our pockets to the giant data centers powering the world’s leading-edge AI applications. As AI continues to rise in reach and complexity, the demand for more memory from data center to endpoints is reshaping the industry’s requirements and traditional approaches to memory architectures. According to OpenAI,... » read more

Latency Considerations For 1.6T Ethernet Designs
By Jon Ames - 12 Oct, 2023 - Comments: 0

Since its 1980s debut with 10Mbps shared LANs over coaxial cables, Ethernet has seen consistent advancements, now with the potential to support speeds up to 1.6Tbps. This progression has allowed Ethernet to serve a wider range of applications, such as live streaming, Radio Access Networks and industrial control, emphasizing the importance of reliable packet transfer and quality of service. With... » read more

RISC-V Wants All Your Cores
By Brian Bailey - 12 Oct, 2023 - Comments: 0

RISC-V is no longer content to disrupt the CPU industry. It is waging war against every type of processor integrated into an SoC or advanced package, an ambitious plan that will face stiff competition from entrenched players with deep-pocketed R&D operations and their well-constructed ecosystems. When Calista Redmond, CEO for RISC-V International, said at last year's summit that RISC-V w... » read more

Arm A-Profile Architecture Developments 2023
By Martin Weidmann - 12 Oct, 2023 - Comments: 0

As computing demands continue to evolve with the rise of artificial intelligence (AI) and advancing security threats, it is imperative that the foundational computing architecture at the heart of the world’s devices continues to evolve. This is why our engineering teams add new features and technologies to the pervasive Arm architecture, with the software teams then ensuring that software lan... » read more

Partitioning Processors For AI Workloads
By Ann Mutschler - 12 Oct, 2023 - Comments: 0

Partitioning in complex chips is beginning to resemble a high-stakes guessing game, where choices need to extrapolate from what is known today to what is expected by the time a chip finally ships. Partitioning of workloads used to be a straightforward task, although not necessarily a simple one. It depended on how a device was expected to be used, the various compute, storage and data paths ... » read more

CXL: The Future Of Memory Interconnect?
By Karen Heyman - 12 Oct, 2023 - Comments: 1

Momentum for sharing memory resources between processor cores is growing inside of data centers, where the explosion in data is driving the need to be able to scale memory up and down in a way that roughly mirrors how processors are used today. A year after the CXL Consortium and JEDEC signed a memorandum of understanding (MOU) to formalize collaboration between the two organizations, suppor... » read more

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