category: Low Power-High Performance

category: IoT, Security & Automotive

Research Bits: Jan. 9
By Jesse Allen - 09 Jan, 2023 - Comments: 0

Making stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Purdue University, and Texas Heart Institute developed a new method to make soft, stretchable transistors easier and cheaper to manufacture. The lateral phase separation induced micromesh (LPSM) process involves mixing a semiconductor and an elastomer and spin coating the liquid mixture pre... » read more

Research Bits: Jan. 3
By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Facing Off Against Growing Chip Design Complexity
By Kelly Damalou - 19 Dec, 2022 - Comments: 0

The semiconductor industry continues to face incredible pressures to deliver higher levels of performance in a smaller area, with lower power demands. From high-performance systems-on-chip for 5G mobile devices and network infrastructure to the radio-frequency transceivers that enable autonomous vehicles and the industrial Internet of Things, today’s applications demand a reduced profile, pai... » read more

3D-IC Reliability Degrades With Increasing Temperature
By Ann Mutschler - 14 Dec, 2022 - Comments: 0

The reliability of 3D-IC designs is dependent upon the ability of engineering teams to control heat, which can significantly degrade performance and accelerate circuit aging. While heat has been problematic in semiconductor design since at least 28nm, it is much more challenging to deal with inside a 3D package, where electromigration can spread to multiple chips on multiple levels. “Be... » read more

Research Bits: Dec. 13
By Jesse Allen - 13 Dec, 2022 - Comments: 0

Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

Variability Becoming More Problematic, More Diverse
By Karen Heyman - 12 Dec, 2022 - Comments: 0

Process variability is becoming more problematic as transistor density increases, both in planar chips and in heterogeneous advanced packages. On the basis of sheer numbers, there are many more things that can wrong. “If you have a chip with 50 billion transistors, then there are 50 places where a one-in-a-billion event can happen,” said Rob Aitken, a Synopsys fellow. And if Intel’s... » read more

Ready, Set, Go: Outrunning Moore’s Law With 3D-IC
By Tony Mastroianni - 08 Dec, 2022 - Comments: 0

By Anthony Mastroianni and Gordon Allan, Siemens EDA 3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization efforts and supporting tool developments begin to make 3D IC practicable and profitable to more players – big and small – and products w... » read more

Edge AI And Chiplets
By Andy Heinig - 08 Dec, 2022 - Comments: 0

In the near future, more edge artificial intelligence (AI) solutions will find their way into our lives. This will be especially true in the private sector for applications in the field of voice input and analysis of camera data, which will become well-established. These application areas require powerful AI hardware to be able to process the corresponding continuously accumulating data volumes... » read more

IC Stresses Affect Reliability At Advanced Nodes
By Ann Mutschler - 08 Dec, 2022 - Comments: 1

Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together for safety- and mission-critical applications. The causes of stress are numerous. In heterogeneous packages, it can stem from multiple components composed of different materials. “These materia... » read more

Boosting Data Center Memory Performance In The Zettabyte Era With HBM3
By Frank Ferro - 08 Dec, 2022 - Comments: 0

We are living in the Zettabyte era, a term first coined by Cisco. Most of the world’s data has been created over the past few years and it is not set to slow down any time soon. Data has become not just big, but enormous! In fact, according to the IDC Global Datasphere 2022-2026 Forecast, the amount of data generated over the next 5 years will be at least 2x the amount of data generated over ... » read more

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