Preparation Of Geometry Models For Mesh Generation And CFD


Making geometry models suitable for CFD meshing is a time-consuming bottleneck in CFD analysis. We will discuss why and ways to fix the problems. Click here to read more. » read more

A New Era For HPC-Driven Engineering Simulation


Market pressure and technological advancements have rapidly changed the way engineers work. Design engineers increasingly work with larger and more complex models, must conduct more frequent simulation analysis, and iterate more rapidly. Compute constraints, however, often result in engineers limiting model sizes and simulation fidelity, or relying on lengthy, overnight simulation runs. ... » read more

Keyword Transformer: A Self-Attention Model For Keyword Spotting


The Transformer architecture has been successful across many domains, including natural language processing, computer vision and speech recognition. In keyword spotting, self-attention has primarily been used on top of convolutional or recurrent encoders. We investigate a range of ways to adapt the Transformer architecture to keyword spotting and introduce the Keyword Transformer (KWT), a fully... » read more

A Multi-Level Analog IC Design Flow For Fast Performance Estimation Using Template-Based Layout Generators And Structural Models


Analog IC design is a very challenging task as essential information is missing in the early design stages. Because the simulation of larger designs is exceedingly computationally expensive at lower abstraction levels, conservative assumptions are usually applied that often result in suboptimal performances such as area and power consumption. In order to enable both early performance estimates ... » read more

Boosting Data Management System Performance


Marios Karatzias, application engineer at ClioSoft, talks with Semiconductor Engineering about the increasing use and re-use of IP in designs, how to best keep track of that IP, and how to optimize the performance of the data management system to deal with IP in heterogeneous chips. This is particularly important in automotive and industrial applications, where a specific version of IP may have... » read more

Research Bits: Aug. 30


Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more

Is There A Limit To The Number of Layers In 3D-NAND?


Memory vendors are racing to add more layers to 3D NAND, a competitive market driven by the explosion in data and the need for higher-capacity solid state drives and faster access time. Micron already is filling orders for 232-layer NAND, and not to be outdone, SK Hynix announced that it will begin volume manufacturing 238-layer 512Gb triple level cell (TLC) 4D NAND in the first half of next... » read more

Research Bits: Aug. 23


Algae-powered microprocessor Engineers from the University of Cambridge, Arm Research, Scottish Association for Marine Science, and Norwegian University of Science and Technology used a widespread species of blue-green algae to power an Arm Cortex M0+ microprocessor continuously for over a year. The algae, Synechocystis, is non-toxic and harvests energy from photosynthesis. The tiny electri... » read more

Challenges Grow For Modeling Auto Performance, Power


Rising complexity in automobiles is creating huge challenges about how to add more safety and comfort features and electronics into vehicles without reducing the overall range they can travel or pricing them so high that only the rich can afford them. While the current focus is on modeling hardware and software to understand interactions between systems, this remains a huge challenge. It req... » read more

Research Bits: Aug. 16


Protein-based circuits Researchers from North Carolina State University and University of Cambridge created self-assembled, protein-based circuits that can perform simple logic functions and take advantage of an electron’s properties at quantum scales. A challenge in creating molecular circuits is the unreliability as circuit size decreases. At the quantum scale, electrons behave like wav... » read more

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