category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Big Changes Ahead For Interposers And Substrates
By Gregory Haley - 24 Mar, 2025 - Comments: 0

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and signal integrity in the most advanced computing systems. This shift is being driven by AI, high-performance computing (HPC), and next-generation communications, where the need for heterogeneous ... » read more

Eliminating Interfacial Delamination in High-Power Automotive Devices
By Chin Joo Tan - 20 Mar, 2025 - Comments: 0

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at the same time, deliver consistent performances. Interfacial delamination is a significant factor that can impact the reliability performance of power devices. It refers to the separation of lay... » read more

TCAD-Based AI Models For Modern Fab Workflows
By Saurabh Suryavanshi - 20 Mar, 2025 - Comments: 0

The relentless pace of semiconductor development continues unabated. Despite the slowdown in Moore’s law, feature sizes continue to shrink as new geometries come online. Constant innovations in both fab processes and device design offer new opportunities but present new challenges. As in so many other areas of electronics, artificial intelligence (AI) is starting to play a significant role. ... » read more

Improving DRAM Performance Using Dual Work-Function Metal Gate (DWMG) Structures
By Daebin Yim - 20 Mar, 2025 - Comments: 0

Dynamic Random Access Memory (DRAM) serves as the backbone of modern computing, enabling devices ranging from smartphones to high-performance servers. As the demand accelerates for higher density and lower power consumption in memory devices, innovation in reducing DRAM leakage currents and enhancing performance becomes essential. One significant challenge in scaling DRAM technology is gate-... » read more

Reflecting On The SPIE Advanced Lithography + Patterning Symposium 2025
By Harry Levinson - 20 Mar, 2025 - Comments: 0

The mood at this year’s SPIE Advanced Lithography + Patterning Symposium was decidedly upbeat. The outlook for business is good, due in large measure to expectations of high demand for chips, driven by artificial intelligence (AI). To realize the potential of AI, increases in chip performance and efficiency are needed, which, in turn, requires advanced patterning. In the Symposium’s technic... » read more

Using Glass As A Dielectric In Electronic Packaging
By Dick Otte - 20 Mar, 2025 - Comments: 0

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with alternative materials. To this end, glass substrates have emerged as a promising alternative with distinct benefits for semiconductor packaging. Major chipmakers, including ... » read more

Four Things Every Engineer Should Know About PFAS
By Jessica Albright - 20 Mar, 2025 - Comments: 0

What are PFAS chemicals? “PFAS” is an acronym for per- and polyfluoroalkyl substances. These man-made chemicals migrate into soil, water, and air when produced and used. There are many ways humans come in contact with PFAS, such as in non-stick cookware or cosmetics, but by far the most significant impact on human health is when PFAS is consumed in drinking water. Exposure to PFAS may resu... » read more

AI And Semiconductor In Reciprocity
By Mike Hung - 20 Mar, 2025 - Comments: 0

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drive the development of semiconductor technologies, with both complementing each other. Semiconductor packaging: The bridge between chip an... » read more

What Exactly Are Chiplets And Heterogeneous Integration?
By Bryon Moyer - 20 Mar, 2025 - Comments: 0

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they're reading. But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, and heterogeneous integration comes in different guises for different people. Both t... » read more

The Rise Of Thin Wafer Processing
By Laura Peters - 20 Mar, 2025 - Comments: 0

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the amount of energy needed to drive them. Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a ... » read more

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