category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Manufacturing Bits: May 15
By Mark LaPedus - 15 May, 2018 - Comments: 0

Space metrology NASA is developing a mini-electron probe based on an array of carbon nanotube dots. The probe would be used in an instrument, which would analyze the chemical properties of rocks and soils on asteroids, moons and planets. For years, NASA has been working with carbon nanotubes in various applications. Carbon nanotubes are hard, cylindrical nanostructures with good electrical ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 May, 2018 - Comments: 0

Test and packaging In a major surprise, Cohu has entered into a definitive agreement to acquire Xcerra for approximately $796 million. With the deal, Cohu will enter the ATE market. Last year, a group from China entered into a definitive agreement under which it would acquire Xcerra. But the U.S. blocked Xcerra’s sale to the Chinese group. Ironically, at one time, Cohu was reportedly lobbyin... » read more

Manufacturing Bits: May 8
By Mark LaPedus - 08 May, 2018 - Comments: 0

Electrolyte transistors Delft University of Technology, the Centre National de la Recherche Scientifique (CNRS) and NTT have developed a nanotransistor technology that will make it easier to measure the concentration of different electrolytes in the body. Electrolytes involve nutrients and chemicals in the body. They perform important functions and a disruption of the electrolyte balance is... » read more

MIS Packaging Takes Off
By Mark LaPedus - 07 May, 2018 - Comments: 0

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 May, 2018 - Comments: 0

Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pri... » read more

Manufacturing Bits: May 1
By Mark LaPedus - 01 May, 2018 - Comments: 0

Adaptive materials The U.S. Army Research Laboratory (ARL) and the University of Maryland have developed a technique to make adaptive materials. Using ultraviolet light, researchers have devised a way that causes a composite material to become stiffer and stronger on-demand. This in turn could enable a variety of new capabilities for the U.S. military, such as rotorcraft design. In this... » read more

Advanced 3D Design Technology Co-Optimization For Manufacturability
By Yu De Chen - 30 Apr, 2018 - Comments: 0

By Yu De Chen, Jacky Huang, Dalong Zhao, Jiangjiang (Jimmy) Gu, and Joseph Ervin Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device structures and the increasing complexity of process innovations introduced to achieve improved product performanc... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Apr, 2018 - Comments: 0

Chipmakers As reported, Intel is struggling at 10nm. Intel already has encountered some difficulties, as the chip giant late last year pushed out the volume ramp of its new 10nm process from the second half of 2017 to the first part of 2018, according to analysts. Intel continues to struggle with 10nm, and has delayed the volume ramp again, according to multiple reports. During its earnings... » read more

Next EUV Issue: Mask 3D Effects
By Mark LaPedus - 25 Apr, 2018 - Comments: 6

As extreme ultraviolet (EUV) lithography moves closer to production, the industry is paying more attention to a problematic phenomenon called mask 3D effects. Mask 3D effects involve the photomask for EUV. In simple terms, a chipmaker designs an IC, which is translated from a file format into a photomask. The mask is a master template for a given IC design. It is placed in a lithography scan... » read more

AI Accelerating Discovery
By Joanne Itow - 25 Apr, 2018 - Comments: 0

In early April 2018, the Materials Research Society held their spring meeting and exhibit at the Phoenix, Arizona convention center. With more than 110 symposium presentations, it was difficult to select which sessions to attend. But one forum caught my eye, “AI for Materials Development”. These days AI seems to be everywhere. As we all speculate about the impact of AI on autonomous driv... » read more

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