category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

Manufacturing Bits: Nov. 7
By Mark LaPedus - 07 Nov, 2017 - Comments: 0

Making a superbeam Lawrence Livermore National Laboratory (LLNL) has combined several lasers to create what it calls a superbeam. The move represents a possible breakthrough in the arena. In theory, lasers can be combined. But the laser beams tend to pass through each other, thereby making a combined laser or a superbeam nearly impossible. With the help of plasma optics, however, LLNL ha... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Nov, 2017 - Comments: 0

Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

Manufacturing Bits: Oct. 31
By Mark LaPedus - 31 Oct, 2017 - Comments: 0

Tiny jet engines The Max Planck Institute for Intelligent Systems has developed the world´s smallest jet engine. Samuel Sánchez, a researcher from the Stuttgart, Germany-based R&D organization, officially received the Guinness World Record certification for the smallest nanotube travelling through fluid. The technology makes use of propulsion, which resembles the characteristics of a ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Oct, 2017 - Comments: 0

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

Toward Neuromorphic Designs
By Katherine Derbyshire - 25 Oct, 2017 - Comments: 1

Part one of this series considered the mechanisms of learning and memory in biological brains. Each neuron has many fibers, which connect to adjacent neurons at synapses. The concentration of ions such as potassium and calcium inside the cell is different from the concentration outside. The cellular membrane thus serves as a capacitor. When a stimulus is received, the neuron releases neur... » read more

Manufacturing Bits: Oct. 24
By Mark LaPedus - 24 Oct, 2017 - Comments: 0

Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the International System of Units (SI). The SI base units include the following metrics or constants--meter, kilogram, second, ampere, kelvin, mole, and the candela. Here’s the fundamental constant... » read more

MCU Sales Up in 2017 And 2018
By Joanne Itow - 24 Oct, 2017 - Comments: 0

Microcontroller (MCU) sales are expected to grow over 9% this year while units increase over 16%. IoT and automotive are the major reason for the growth in general MCUs; however, the product group has been transitioning into several distinct segments that are being buried within the data of the broad MCU market. Over the past five years total MCU revenues have essentially remained flat; however... » read more

Radar Versus LiDAR
By Mark LaPedus - 23 Oct, 2017 - Comments: 6

Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Oct, 2017 - Comments: 0

Market research The IC market remains hot, as several market researchers are raising their forecasts--again. Gartner recently raised its overall IC forecast. Now, IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its mid-year update. In March, IC Insights raised its worldwide IC market growth forecast for 2017 ... » read more

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