category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Speeding Up Mask Production
By Mark LaPedus - 12 Sep, 2016 - Comments: 0

Chip production is becoming more complex and expensive at each node. As a result, chipmakers require a growing number of new manufacturing technologies to enable the next wave of devices at advanced nodes. In the fab, for example, the most obvious need is extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography. In addition, chipmakers also need a new class of atomic-level proces... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Sep, 2016 - Comments: 0

Chipmakers GlobalFoundries has rolled out its next-generation FD-SOI technology. The new 12nm FD-SOI process is called 12FDX. It is designed for a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles. "Some applications require the unsurpassed performance of finFET transistors, but the vast majority of connected devices need high l... » read more

Manufacturing Bits: Sept. 6
By Mark LaPedus - 06 Sep, 2016 - Comments: 0

DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Sep, 2016 - Comments: 0

Chipmakers AMD has entered into a long-term amendment to its wafer supply agreement (WSA) with GlobalFoundries for the period from Jan. 1, 2016 to Dec. 31, 2020. Today, GlobalFoundries’ Fab 8 in Malta, N.Y. is playing a big role in providing leading-edge foundry capacity for AMD's graphics and processor products. As part of the amended deal, AMD will grant to West Coast Hitech, a subsidia... » read more

Manufacturing Bits: Aug. 30
By Mark LaPedus - 30 Aug, 2016 - Comments: 0

Redefining the ampere In 2014, an international group called the BIPM agreed to redefine four common units of measurements--the kilogram, the ampere, the kelvin and the mole. These units of measurement make up the so-called International System of Units or SI. In total, there are seven SI base units—meter, kilogram, second, ampere, kelvin, mole, and the candela. Work is already under wa... » read more

The Week In Review: Manufacturing
By Ed Sperling - 26 Aug, 2016 - Comments: 0

Numbers IC Insights predicts TowerJazz and SMIC sales will jump this year, with the total pure-play foundry revenue forecast to grow 9%. That compares with 6% growth last year. TSMC is expected to shrink slightly to 58% market share, with GlobalFoundries staying flat at 11%. UMC will remain in third place in the rankings, followed by SMIC and TowerJazz. SEMI’s book-to-bill ratio jumped to... » read more

Stepping Back From Scaling
By Ed Sperling - 24 Aug, 2016 - Comments: 0

Architectures, packaging and software are becoming core areas for semiconductor research and development, setting the stage for a series of shifts that will impact a large swath of the semiconductor industry. While there is still demand from the largest chipmakers for increased density at the next process node, the underlying economics for foundries, equipment vendors and IP developers are f... » read more

Manufacturing Bits: Aug. 23
By Ed Sperling - 23 Aug, 2016 - Comments: 0

Rolling Out Solar Power...Literally An International team of researchers have developed solar cells that can be added onto a roll of flexible plastic in liquid form, bringing the same kind of economies of production to the solar industry as rolls of paper and ink did for newspapers more than a century ago. Using a roll-to-roll processing method, the team was able to achieve a power conversi... » read more

Faster Time To Yield
By Ed Sperling - 23 Aug, 2016 - Comments: 2

Michael Jamiolkowski, president and CEO of Coventor, sat down with Semiconductor Engineering to talk about ways improve yield ramp and optimize designs. What follows are excerpts of that conversation. SE: Why does it take so long to get a chip all the way through to manufacturing? Jamiolkowski: There are three parts to that. There is a research side. You want to be able to explore new th... » read more

Deeper Inside Intel
By Mark LaPedus - 22 Aug, 2016 - Comments: 5

Mark Bohr, senior fellow and director of process architecture and integration at Intel, and Zane Ball, vice president in the Technology and Manufacturing Group at Intel and co-general manager of Intel Custom Foundry, sat down with Semiconductor Engineering to discuss the future directions of transistors, process technology, the foundry business and packaging. What follows are excerpts of those ... » read more

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