category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

The Week In Review: Manufacturing
By Mark LaPedus - 05 Aug, 2016 - Comments: 0

Chipmakers The wearables market has taken another hit. Intel has issued a safety recall for a smartwatch line from its Basis Science subsidiary. "We are issuing this safety recall of the Basis Peak watch because the watch can overheat, which could result in burns or blisters on the skin surface. It is important that you stop using your watch immediately and return it. Although we are stopping ... » read more

Manufacturing Bits: Aug. 2
By Mark LaPedus - 02 Aug, 2016 - Comments: 0

CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

Stacked Die Changes
By Ed Sperling - 27 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at Samsung; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. What follows are excerpts of tha... » read more

Manufacturing Bits: July 26
By Mark LaPedus - 26 Jul, 2016 - Comments: 0

Jumping films Riken and the University of Tokyo have developed a tiny autonomous actuator. The actuator, which is based on a special material, can automatically curl up or straighten out when exposed to ambient humidity. And in certain conditions, the film can even jump into the air by itself. A video can be seen here. Researchers placed a material called guanidinium carbonate into a hig... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jul, 2016 - Comments: 2

Market research Worldwide semiconductor capital spending is projected to decline 0.7% in 2016, to $64.3 billion, according to Gartner. This is up from the estimated 2% decline in Gartner's previous quarterly forecast. "Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This ... » read more

Roots Of Distrust Spread
By Ed Sperling - 21 Jul, 2016 - Comments: 0

For most of the history of semiconductors there has been a persistent fear that someone would steal intellectual property from one company and sell it to another. There have been innumerable lawsuits involving corporate secrets that cross from one company to the next, and from one country to the next. The biggest concerns always were at the leading edges of technology, where those secrets w... » read more

5 Takeaways From Semicon
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

As usual, the recent Semicon West trade show was a busy, if not an overwhelming, event. The event, which took place in San Francisco in early July, featured presentations on the usual subjects in the semiconductor and IC-equipment sectors. There were sessions on 200mm, next-generation processes, transistors, lithography, MEMS and many others. In no particular order, here are my five ta... » read more

Material And Process Challenges In A Changing Memory Landscape
By Er-Xuan Ping - 21 Jul, 2016 - Comments: 0

Moore’s Law has fueled the semiconductor industry’s growth for decades. But as the complexity of scaling increases, extending the economics of Moore’s Law is becoming a challenge. One example illustrating the challenges of maintaining the economic benefits of Moore’s Law is the difficulty of IC chip patterning. Today, this requires an expensive litho scanner, a complicated spacer and... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy