category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Introduction To Multi-Patterning
By Mentor, a Siemens Business - 20 Jul, 2016 - Comments: 0

Multi-patterning enables accurate lithographic resolution at today's most advanced nodes. Learn about the basics of this technology, and how it impacts your IC design and verification tasks and responsibilities. To read more, click here. » read more

Manufacturing Bits: July 19
By Mark LaPedus - 19 Jul, 2016 - Comments: 0

Detecting anapoles A*STAR has detected invisible particles. Researchers from the Singaporean R&D organization have observed a new optical effect in nanoscale disks of silicon, which are patterns of radiation that do not scatter light. One example of a non-radiating source is called an anapole. An anapole, according to A*Star, is a distribution of charges and currents. They do not radiate wi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jul, 2016 - Comments: 0

Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

Manufacturing Bits: July 12
By Mark LaPedus - 12 Jul, 2016 - Comments: 0

Detecting zeptojoules Aalto University has broken the world’s record for microwave detection. Specifically, researchers detected zeptojoule microwave pulses using a superconducting microwave detector, based on proximity-induced Josephson junctions. This broke the record by fourteenfold, according to researchers. Microwaves are a form of electromagnetic radiation. They have frequencies... » read more

FD-SOI Strains For The Future
By Katherine Derbyshire - 11 Jul, 2016 - Comments: 0

One of the challenges facing supporters of FD-SOI is the need to provide a pathway to improved performance. While FD-SOI wafers offer some significant advantages over bulk silicon wafers, performance enhancements like strain and alternative channel materials are more difficult to implement in the thin SOI environment. On the other hand, once a fab is willing to incorporate layer transfer techni... » read more

E-beam Vs. Optical Inspection
By Mark LaPedus - 11 Jul, 2016 - Comments: 0

The wafer inspection business is heating up as chipmakers encounter new and tiny killer defects in advanced devices. Last month ASML Holding entered into an agreement to acquire Hermes Microvision (HMI), the world’s largest e-beam inspection vendor, for $3.1 billion. The proposed move propelled ASML into the e-beam wafer inspection market. In addition, [getentity id="22817" e_name="Appl... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jul, 2016 - Comments: 2

Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

Manufacturing Bits: July 5
By Mark LaPedus - 05 Jul, 2016 - Comments: 0

World’s largest telescope China stunned the industry last month, when the nation rolled out the world’s fastest supercomputer. The system, dubbed the Sunway TaihuLight, is based on processors made in China, not Intel or other U.S. chipmakers. Now, China has nearly finished the construction of the world’s largest radio telescope. The system, dubbed the Five-hundred-meter Aperture Sphe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Jul, 2016 - Comments: 0

Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

Atomic Layer Etch Heats Up
By Mark LaPedus - 29 Jun, 2016 - Comments: 0

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

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