category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

ReRAM Gains Even More Steam
By Michael Watts - 19 Nov, 2015 - Comments: 0

The prospect of using the latest in finFET processing to enable embedded non-volatile memory (NWM) will be described by a team from TSMC and Tsing Hua University in Taiwan at the IEDM meeting on Dec. 8 in Washington, D.C. Embedded NVM has been the first commercial application of ReRam, with products from Panasonic and Terrazon. Industry leaders agree the creation of NVM as a seamless additio... » read more

What’s Really Causing Line-Edge Roughness?
By Katherine Derbyshire - 19 Nov, 2015 - Comments: 0

As previously discussed, shot noise is an important contributor to line edge roughness. However, as the title of one paper on the subject put it, “Do not always blame the photons.” The line edge roughness of a chemically amplified resist ultimately depends on photoacid generation and the deprotection of the resist’s base monomers. Photons absorbed by the resist simply trigger a chain ... » read more

The Silicon Foundry Market Is Alive And Well
By Rich Wawrzyniak - 19 Nov, 2015 - Comments: 0

I attended the ARM TechCon conference in Santa Clara last week and met with the GlobalFoundries team to discuss their new 14nm finFET technology. GlobalFoundries’ 14LPP technology offering was qualified in the third quarter of 2015 and is on track for volume production in 2016. FX-14 design kits are available to customers now.  This announcement was the culmination of an extensive body of... » read more

Analog Design And Pattern Matching: A Perfect Pairing
By Ed Sperling - 18 Nov, 2015 - Comments: 0

While automated pattern matching is widely used in the digital IC physical verification process, adoption in the analog space has been much slower. In fact, the very nature of customized analog circuits lends itself ideally to some of the newer physical verification techniques offered by automated pattern matching technology, enabling designers to reduce verification time while still ensuring d... » read more

Manufacturing Bits: Nov. 17
By Mark LaPedus - 17 Nov, 2015 - Comments: 0

Speedy nano-scale subs For years, researchers have been developing nano-scale submarines. In theory, nano-subs could be used in various applications. For example, they could navigate inside the human body and transport medicine to various organs. The problem? Most nano-subs use or generate toxic chemicals, according to researchers from Rice University. Seeking to solve the problem, Rice ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Nov, 2015 - Comments: 0

IC Insights released its preliminary top IC rankings in terms of sales for 2015. In the rankings, Intel remains in first place in terms of chip sales in 2015, followed by Samsung and TSMC. GlobalFoundries and UMC also moved up in the rankings. Beyond that, the market is in flux. “The pending mergers of Avago and Broadcom and NXP and Freescale will have a significant impact on future top-20 ra... » read more

Tech Talk: 14nm And Stacked Die
By Ed Sperling - 11 Nov, 2015 - Comments: 0

Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

Manufacturing Bits: Nov. 10
By Mark LaPedus - 10 Nov, 2015 - Comments: 1

Etching superconducting materials Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on the Kelvin scale to work. This, in turn, limits their applications. Absolute zero equates to −273.15° on the Celsius scale and −459.67° on the Fahrenheit ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Nov, 2015 - Comments: 0

China is investing billions of dollars in the IC industry and equipment sectors. The nation is also in the midst of an acquisition and an investment spree, especially in IC packaging. For example, Jiangsu Changjiang Electronics Technology (JCET), a Chinese OSAT, shook up the landscape by recently announcing a deal to acquire STATS ChipPAC for $780 million. The deal was completed in August of 20... » read more

Manufacturing Bits: Nov. 3
By Mark LaPedus - 03 Nov, 2015 - Comments: 0

World’s fastest phototransistor The University of Wisconsin-Madison has developed what the university claims is the world’s fastest and most responsive flexible silicon phototransistor. Phototransistors are semiconductor light sensors. They are based on a transistor with a transparent cover. They provide better sensitivity than a photodiode. The futuristic phototransistor from the Un... » read more

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