Chip Industry Week In Review

By The SE Staff - 27 Oct, 2023 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan The Biden-Harris administration designated 31 Tech Hubs across the U.S. this week, focused on industries including autonomous systems, quantum computing, biotechnology, precision medicine, clean energy advancement, and semiconductor manufacturing. The Department of Commerce (DOC) also launched its second Tech Hubs Notice of Funding Opportunity. ... » read more

Blog Review: October 25

By Jesse Allen - 25 Oct, 2023 - Comments: 0

Synopsys’ Graham Allan looks at enhancements in the LPDDR5X standard, such as a speed increase from 6.4Gbps to 8.5Gbps using the same 1.1V core voltage as LPDDR5 alongside better signal integrity, reliability, and battery efficiency. Cadence’s Krunal Patel examines the essential components and operation of MACsec, a security protocol to ensure the confidentiality and integrity of data tr... » read more

Chip Industry Week In Review

By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Blog Review: October 18

By Jesse Allen - 18 Oct, 2023 - Comments: 0

Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

EDA Revenue Up Again

By Ed Sperling - 17 Oct, 2023 - Comments: 0

The EDA industry reached $3.963 billion in revenue in Q2, boosted by a 17.6% increase in computer-aided engineering and a 17.2% increase in IP physical design and verification, according to a just-released ESD Alliance Electronic Market Data report. The overall growth was offset by an accounting change in the IP business, which resulted in a 11.6% decline to $1.255 billion, as well as some w... » read more

Chip Industry Week In Review

By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

Blog Review: October 11

By Jesse Allen - 11 Oct, 2023 - Comments: 0

Cadence's Sangeeta Soni examines Integrity and Data Encryption (IDE) verification considerations for Compute Express Link (CXL) devices, including MAC generation and handling, key programming and exchange, and early MAC termination. Synopsys' Madhumita Sanyal points to how the increased bandwidth of PCIe 6.0 supports the demanding requirements of AI accelerators. Siemens' Kevin Webb expla... » read more

Chip Industry Week In Review

By The SE Staff - 06 Oct, 2023 - Comments: 0

By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Blog Review: October 4

By Jesse Allen - 04 Oct, 2023 - Comments: 0

Cadence's Felipe Goncalves checks out the Integrity and Data Encryption (IDE) feature in PCIe 6.0, a new layer inserted between the transection layer and data link layer with the goal of protecting against threats from physical attacks on the link. Siemens' Robin Bornoff, Daniel Berger, and Kai Liu explore the potential for large language models (LLMs) make the use of CAE tools simpler, more... » read more

Chip Industry Week In Review

By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

category: News

category: IoT, Security & Automotive

Chip Industry Week In Review

Blog Review: October 25

Chip Industry Week In Review

Blog Review: October 18

EDA Revenue Up Again

Chip Industry Week In Review

Blog Review: October 11

Chip Industry Week In Review

Blog Review: October 4

Chip Industry Week In Review

Trending Articles

Is In-Memory Compute Still Alive?

Baby Steps Toward 3D DRAM