category: News

category: IoT, Security & Automotive

Week In Review: Design, Low Power
By Jesse Allen - 05 May, 2023 - Comments: 0

Arm advanced its progress toward an initial public offering, confidentially submitting a draft registration statement on Form F-1 to the U.S. Securities and Exchange Commission. The size and price range for the proposed offering have yet to be determined. Graphene IDM Paragraf acquired Cardea Bio, a maker of graphene-based biocompatible chips. Cardea has developed a biosignal processing unit... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 May, 2023 - Comments: 0

Pervasive computing Microsoft and AMD are working together on an AI processor, according to a report in Bloomberg. Tenstorrent adopted Arteris IP’s Ncore and FlexNoC interconnect IP for its AI RISC-V chiplets. The chiplets will be configurable for different uses and workloads. Some use cases include AI high-performance computing for data center, such as cloud servers, and edge devices and... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2023 - Comments: 0

Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

EDA Posts Q4 2022 Revenue of $3.9B
By Ann Mutschler - 01 May, 2023 - Comments: 0

The ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report that the Electronic System Design (ESD) industry revenue increased 11.3% from $3.47 billion in the fourth quarter of 2021 to $3.86 billion in the fourth quarter of 2022. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.6... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 28 Apr, 2023 - Comments: 0

The U.S. Commerce Department  launched Chips.gov, a website that covers all aspects of the CHIPS Act, including funding opportunities and job openings. In similar vein, Intel CEO Pat Gelsinger focused on the future of semiconductor manufacturing in America in a talk at MIT. Intel has committed to expanding semiconductor manufacturing in the U.S., including spending an initial $20 billion on ne... » read more

Week In Review: Design, Low Power
By Jesse Allen - 28 Apr, 2023 - Comments: 0

The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Apr, 2023 - Comments: 0

Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

Blog Review: April 26
By Jesse Allen - 26 Apr, 2023 - Comments: 0

Codasip's Tora Fridholm introduces the NimbleAI project, an effort to design a neuromorphic sensing and processing 3D integrated chip that implements an always-on sensing stage, highly specialized event-driven processing kernels and neural networks to perform visual inference of selected stimuli using the bare minimum amount of energy. Synopsys' Anjaneya Thakar discusses computational lithog... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 21 Apr, 2023 - Comments: 0

GlobalFoundries filed suit in U.S. District Court in New York against IBM, accusing it of unlawfully disclosing IP and trade secrets to IBM partners, including Intel and Rapidus, potentially receiving hundreds of millions of dollars in licensing income and other benefits. The European Union released a €43 billion ($47 billion) plan for jumpstarting its semiconductor manufacturing industry,... » read more

Week In Review: Design, Low Power
By Linda Christensen - 21 Apr, 2023 - Comments: 0

Cadence rolled out a slew of new products at this week’s CDNLive Silicon Valley, including: A new generative AI-powered tool for analog, mixed-signal, RF and photonics design; An extended collaboration with TSMC and Microsoft to advance giga-scale physical verification system in the cloud; A multi-year partnership with the San Francisco 49ers football organization, focused on sust... » read more

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