Week In Review: Semiconductor Manufacturing, Test

TSMC delays construction on Arizona fab; SIA, industry execs urge caution in China chip policy; heterogenous integration; onsemi inks $1 billion deal, Silicon Box’s new Singapore fab, world’s first GDDR7 DRAM, 4 exoflop supercomputer.


TSMC is delaying construction on its $40 billion fab in Arizona due to a shortage of U.S. semiconductor workers and higher-than-expected expenses, Bloomberg reported.

The Semiconductor Industry Association (SIA) urged the U.S. government to refrain from further restrictions on semiconductor technology to China “until it engages more extensively with industry and experts to assess the impact of current and potential restrictions to determine whether they are narrow and clearly defined, consistently applied, and fully coordinated with allies.” The call for halting more restrictions was supported by industry executives meeting with top Biden administration officials in Washington this week, according to Reuters.

Onsemi signed an expansion agreement worth more than $1 billion in overall value with U.S. automotive supplier BorgWarner for SiC power devices. The deal includes EliteSiC 1,200V and 750V power devices, which help increase power density and efficiency and therefore extend electric vehicle range.

Stellantis announced it has secured contracts worth €10 billion ($11.2 billion) through 2030 to guarantee the flow of vital chips for electric vehicles, including SoCs.

Lam Research released its 2022 Environmental, Social, and Governance (ESG) report documenting the company’s progress toward net zero. “As we continue to innovate the next generation of technology breakthroughs, we must do so while considering the long-term sustainability of our industry and our planet,” said Tim Archer, Lam’s president and CEO.

The global power semiconductor market is projected to hit $60.2 billion by 2032, up from $41.6 billion in 2022, and growing at a CAGR of 3.8%, according to a new report by Acumen Research and Consulting.


Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. This tech talk dives into a variety of issues ranging from uneven aging, warpage, and different mechanical stresses, as well as some possible benefits.

Silicon Box opened a $2 billion advanced semiconductor manufacturing foundry in Singapore. The new facility will focus on the adoption of chiplet technology.

The semiconductor packaging materials market is forecast to grow more than $10 billion between 2022 and 2027 at a CAGR of 6.06%, according to a new report by Infiniti Research.


Synopsys  announced advanced designs for the TSMC N3E process to reduce integration risk and accelerate time to first-pass silicon. The IP is compliant with an array of standards, including 112G Ethernet, LPDDR5X, DDR5, PCIe, USB/DisplayPort and MIPI C/D-PHY.

Samsung announced that it completed development of the industry’s first 16Gb GDDR7 chip with a bandwidth of 1.5 TBps.

SEMICON West will take place July 9 – 11 at the Moscone Center in San Francisco next year, moving to the Phoenix Convention Center the following Oct. 7 – 9, 2025. Thereafter, it will alternate between San Francisco and Phoenix.


The University of Washington received a $10 million grant for semiconductor workforce development and research from the US CHIPS and Science Act. The funding, allocated through the National Science Foundation, will go toward the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future project.

Further reading

See the latest Manufacturing, Packaging and Materials newsletter for these feature articles:

  • 193i Lithography Takes Center Stage…Again
  • Smart Manufacturing Makes Gains in Chip Industry
  • Will CFETs Help the Industry Go Vertical?

Read our Test, Measurement & Analytics newsletter for these highlights and more:

  • Pinpointing Timing Delays in Complex SoCs
  • Mission Critical Devices Drive System-Level Test Expansion
  • Governments Begin to Shape Metrology Directions

Upcoming events in the chip industry:

  • Rambus Design Summit, July 18 – 19 (Virtual)
  • CHIPcon2023: Chiplet and Heterogeneous Integration Packaging (formerly IMAPS aSIP), July 24 – 27 (San Jose, CA)
  • SPIE Optics + Photonics 2023, Aug 20 – 24 (San Diego, CA)

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