tag: University of Washington

Security Technical Paper Roundup: Aug. 27
By Liz Allan - 27 Aug, 2024 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Data Memory-Dependent Prefetchers Pose SW Security Threat By Breaking Cryptographic Implementations
By Technical Paper Link - 19 Aug, 2024 - Comments: 0

A technical paper titled “GoFetch: Breaking Constant-Time Cryptographic Implementations Using Data Memory-Dependent Prefetchers” was presented at the August 2024 USENIX Security Symposium by researchers at University of Illinois Urbana-Champaign, University of Texas at Austin, Georgia Institute of Technology, University of California Berkeley, University of Washington, and Carnegie Mellon U... » read more

Chip Industry Technical Paper Roundup: July 30
By Linda Christensen - 30 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library, including a best paper award winner at ISCA. [table id=246 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Survey of CXL Implementations and Standards (Intel, Microsoft)
By Technical Paper Link - 22 Jul, 2024 - Comments: 0

A new technical paper titled "An Introduction to the Compute Express Link (CXL) Interconnect" was published by researchers at Intel Corporation, Microsoft, and University of Washington. Abstract "The Compute Express Link (CXL) is an open industry-standard interconnect between processors and devices such as accelerators, memory buffers, smart network interfaces, persistent memory, and solid-... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: Mar. 5
By Linda Christensen - 05 Mar, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=201 /] » read more

Performing Multiple, Simultaneous Depositions In A High-Throughput, Multiplexing ALD/MLD-Style Reactor
By Technical Paper Link - 22 Feb, 2024 - Comments: 0

A technical paper titled “High throughput multiplexing reactor design for rapid screening of atomic/molecular layer deposition processes” was published by researchers at University of Washington. Abstract: "An approach is demonstrated for performing multiple, simultaneous depositions in a high-throughput, multiplexing atomic layer deposition/molecular layer deposition (ALD/MLD)-style reac... » read more

Chip Industry Technical Paper Roundup: Feb. 19
By Liz Allan - 19 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=199 /] More ReadingTechnical Paper Library home » read more

Directly Writing and Rewriting Photonic Chips on Low-Loss Phase-Change Thin Films
By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “Freeform direct-write and rewritable photonic integrated circuits in phase-change thin films” was published by researchers at University of Washington, University of Maryland, and Tianjin University. Abstract: "Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technolo... » read more

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