Chip Industry Week In Review


Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Week In Review


The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

Blog Review: Feb. 19


Cadence's Ravi Vora explains the AMBA Local Translation Interface protocol, which defines the point-to-point protocol between an I/O device and the Translation Buffer Unit of an Arm System Memory Management Unit. Siemens' Stephen V. Chavez provides a checklist for ensuring the quality and functionality of a PCB at every stage, from design through fabrication, assembly, and testing, with a fo... » read more

Chip Industry Week In Review


Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

Chip Industry Week In Review


The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70%  2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Blog Review: Feb. 5


Cadence's Rajneesh Chauhan explores the extended metadata feature in CXL 3.1, which helps systems manage memory and devices more effectively by sending extra information along with memory transactions to provide more context about what's happening during these transactions. Siemens' Bianca Ward recommends semiconductor companies combat rising production costs by leaning into digitalization a... » read more

Chip Industry Week In Review


Chinese startup DeepSeek rattled the tech world and U.S. stock market with claims it spent just $5.6 million on compute power for its AI model compared to its billion-dollar rivals in the U.S. The announcement raised questions about U.S. investment strategies in AI infrastructure and led to an initial $600 billion selloff of NVIDIA stock. Since its launch, DeepSeek reportedly was hit by malicio... » read more

Blog Review: Jan. 29


Cadence's Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond. Siemens' Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for the e... » read more

Chip Industry Week In Review


The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Blog Review: Jan. 22


Cadence's David Shin provides an overview of the eUSB2V2 specification, which scales up to 4.8Gbps of data rate and provides the flexibility to configure either asymmetrical or symmetrical links depending on the intended application. Siemens EDA's Spencer Acain highlights the key role of AI in semiconductor testing, including the addition of analytical AI in DFT tools and how applying machin... » read more

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