category: News

category: IoT, Security & Automotive

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review
By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Blog Review: Sept. 25
By Jesse Allen - 25 Sep, 2024 - Comments: 0

Cadence’s Mamta Rana digs into how PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased data rates and improved efficiency but making verification of shared credit updates essential. Siemens’ Nicolae Tusinschi provides a primer on formal verification, including what makes it different from simulation, pr... » read more

Chip Industry Week In Review
By The SE Staff - 20 Sep, 2024 - Comments: 0

Synopsys agreed to sell its Optical Solutions Group to Keysight for an undisclosed amount, in a deal deemed necessary for Synopsys to win regulatory approval for its planned acquisition of Ansys. The sale to Keysight is contingent on the Synopsys-Ansys deal going through. Meanwhile, Ansys has its own optical business. The U.S. Department of Defense (DoD) made the first awards for Microelectr... » read more

Blog Review: Sept. 18
By Jesse Allen - 18 Sep, 2024 - Comments: 0

Siemens’ Kyle Fraunfelter explores the similarities between hurricane forecasting and semiconductor manufacturing to argue for the value of integrating real-time wafer fabrication measurements into the digital twin models used to simulate the semiconductor fabrication process. Cadence’s Rohini Kollipara introduces Display Stream Compression (DSC), which can enable higher resolutions and ... » read more

Chip Industry Week In Review
By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

Blog Review: Sept. 11
By Jesse Allen - 11 Sep, 2024 - Comments: 0

Cadence's Neha Joshi introduces the IEEE 1801 standard, also known as UPF (Unified Power Format), which offers a uniform framework for defining power domains, power states, and power intent to ensure consistency across diverse tools and phases of the design process. Siemens' John McMillan warns that known good die may not behave the same in 3D-ICs as they do standalone and suggests that mult... » read more

Chip Industry Week In Review
By The SE Staff - 06 Sep, 2024 - Comments: 0

Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Blog Review: Sept. 4
By Jesse Allen - 04 Sep, 2024 - Comments: 0

Synopsys' Jyotika Athavale and Randy Fish sit down with Google's Rama Govindaraju and Microsoft's Robert S. Chappell to discuss silent data corruption and why a solution will require chip designers and manufacturers, software and hardware engineers, vendors, and anyone involved in computer data to collaborate and take the issue seriously. Siemens' Karen Chow and Joel Mercier explain the rela... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

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