Chip Industry Week in Review


The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d... » read more

Automotive Week In Review


Quick links: Deals and New Chips, Batteries and BEVs, Autonomous, Policy and Research. Deals and New Chips Infineon and BMW are jointly developing software-defined vehicles based on BMW’s “Neue Klasse” architecture and Infineon’s MCUs, high-speed Ethernet solutions, power management ICs, and power switches. Tata Electronics will manufacture Qualcomm's automotive modules in I... » read more

Blog Review: Feb. 18


Synopsys' Raja Tabet anticipates deployment of an agentic AI workforce within the next 12 to 24 months that can take on different engineering personas, such as a digital implementation agent, a verification agent, or an analog agent, to run experiments in parallel, generate and triage tests, and propose fixes. Cadence's Reela Samuel dives into power usage effectiveness in data centers and wh... » read more

Chip Industry Week In Review


Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Automotive Week In Review


Quick links: Automotive chips, Autonomous, EVs, Batteries, Policy, Research. Automotive chips  Mythic and Honda will jointly develop an automotive-grade AI SoC for Honda’s SDVs that leverages Mythic’s energy-efficient analog compute-in-memory technology. ST released a new MCU with AI acceleration for the automotive edge, integrating an embedded neural network accelerator. I... » read more

Chip Industry Week in Review


Intel hired ex-Qualcomm GPU guru Eric Demers for the company's high-performance GPU push, setting the stage for a three-way battle with Nvidia and AMD. The key targets for Intel and AMD will be better power efficiency and a programming model that rivals CUDA, but don't expect Nvidia to stand still. Acquisitions Texas Instruments plans to acquire Silicon Labs for ~$7.5B cash to enhance i... » read more

Blog Review: Feb. 4


Siemens' Tova Levy examines thermal management in 3D-IC, including why heat behaves differently in vertical stacks and how to analyze and manage thermal risk earlier and more predictably to ensure a design can meet performance, reliability, and time-to-market targets. Cadence's Reela Samuel finds that known-good-die strategies, standardized die-to-die test access, and vertical reliability mo... » read more

Chip Industry Week In Review


Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections.  Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q... » read more

Blog Review: Jan. 28


Synopsys' Dana Neustadter and Vincent van der Leest argue that a hardware-based approach to security is required to fully address the risks introduced by modern AI architectures and the distributed workloads they support. Siemens EDA's Tova Levy examines multiphysics challenges in 3D-IC designs and outlines three design imperatives to identify risks earlier and support PPA, reliability, and ... » read more

Chip Industry Week In Review


TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

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