Blog Review: Jan. 21


Keysight's Armando Valim considers the impact of AI on the memory market as AI infrastructure pressure widens the gap between high-performance memory and lower-margin consumer memory and SSD, forcing manufacturers to make strategic decisions and define which markets to serve. Cadence's Reela Samuel breaks down the major 3D-IC packaging methods used today, from wafer stacking flows to hybrid ... » read more

Chip Industry Week in Review


Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Blog Review: Jan. 14


Arm's Paul Black demonstrates how lightweight LLVM sanitizers help detect undefined behavior, improve code quality, and expose hidden bugs in embedded C and C++ projects, with a focus on two sanitizers that can catch issues such as unsigned signed shift overflows, array overflows, and stack corruption. Imagination's Alex Pim provides an overview of LLM inference acceleration for mobile and e... » read more

EDA and IP Revenue Up 8.8%


EDA and IP revenue grew 8.8% in Q3 2025 to $5.566 billion, up from $5.115 billion in the same period in 2024, according to new data from ESD Alliance. But beneath those respectable, if not spectacular numbers, some interesting shifts are underway. China returned to double-digit growth after several quarters of lackluster sales. But the biggest surprise was EDA/IP revenues from South Korea an... » read more

Chip Industry Week in Review


SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Blog Review: Jan. 7


Cadence's Reela Samuel presents an overview of through-silicon vias, including structure, pitch, and electrical behavior, key layout rules such as keep-out zones and stress constraints, and how TSV parasitics influence bandwidth, latency, and system-level performance. Siemens' Andras Vass-Varnai identifies five thermal trends to watch and how they’ll reshape design and packaging workflows ... » read more

Chip Industry Week In Review


Space Forge autonomously generated plasma aboard its ForgeStar-1 satellite, utilizing extreme low Earth orbit (LEO) conditions needed for gas-phase crystal growth of wide- and ultra-wide bandgap materials, GaN, SiC, aluminum nitride, and diamonds. Copper prices surged to a historic record of $12,600 per metric ton, an increase of more than 40% YOY, which will impact the cost of data center b... » read more

Chip Industry’s Top Videos 2025


Rising complexity, new architectures, and AI's permeation of nearly everything left engineers struggling to keep up in 2025, as evidenced by this year's viewership numbers. Among the hottest topics were verification, agentic AI, DRAM/HBM, optimization of data movement, chiplets, and heterogeneous integration, but there was steady traffic growth across all sectors. Top 10 most-watched videos ... » read more

Chip Industry Week In Review


Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

Blog Review: Dec. 24


Cadence's Jakob Engblom shares highlights from the recent SDV Europe conference, including why software-defined vehicles will require much closer, faster collaboration between suppliers and customers, with virtualization for software development and testing taking on a key role, as well as API questions and tire sensors. Synopsys' Tom De Schutter and Marc Serughetti predict that new cars wil... » read more

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