Chip Industry’s Top Videos 2025

Rising complexity, new architectures, and AI’s permeation of nearly everything left engineers struggling to keep up in 2025, as evidenced by this year’s viewership numbers. Among the hottest topics were verification, agentic AI, DRAM/HBM, optimization of data movement, chiplets, and heterogeneous integration, but there was steady traffic growth across all sectors.

Top 10 most-watched videos this year:

• Scenario Coverage In Formal Verification
• Agentic AI In Chip Design
• The Road To Super Chips
• Livelocks And Deadlocks In NoCs
• Evolution of DRAM
• What’s Different About HBM4
• Challenges In Stacking HBM
• Optimizing Data Movement In SoCs And Advanced Packages
• Benefits And Challenges Of Using Chiplets
• Using AI In Semiconductor Inspection

Below are quick links to Semiconductor Engineering’s five channels, and a breakdown of the 48 videos published by channel:

Test, Measurement And Analytics
Low Power – High Performance
Systems And Design
Automotive, Security And Enabling Technologies
Manufacturing, Packaging And Materials

For more Semiconductor Engineering videos, check out the full list of over 500 tech talks here.

Test, Measurement And Analytics

• DFT Shifts Further Left describes how multi-die assemblies are changing design for test.
• Improving IC System Quality And Performance breaks down how production analytics can improve performance and reliability of chips over time.
• In-System Test For AI Data Centers digs into how test and monitoring data can improve the lifespan of devices.
• Silicon Lifecycle Management explains how in-device monitoring can improve the reliability and lifespan of semiconductors.
• Challenges In Stacking HBM describes what changes are needed to stack 24 layers of high-bandwidth memory.
• Issues In Ramping Advanced Packaging details why traditional daisy chain approaches fall short.
• Changes In Scan Test Data looks at better management of data in multi-core designs.
• Silent Data Corruption explains what the topics is, what to do about it, and why should you care.
• Rethinking Scan Chains In Semiconductor Test lays out why finding defects now requires multiple data types, and a much more thorough search.
• Problems In Testing AI Chips covers how reliability depends on consistency in contacts and clean signals.
• What’s Changing In Outlier Detection talks about augmenting testing metrics to improve reliability.
• Using AI In Semiconductor Inspection focuses on finding anomalies and defects faster in complex chip and package topographies.

Low Power – High Performance

• LPDDR6: Not Just For Mobile Anymore explains why and how the go-to-DRAM for low-power devices is pushing beyond its roots.
• Critical Factors For Storing Data In DRAM highlights new concerns and challenges for memory in AI data centers.
• The Rise Of AI Co-Processors addresses how keeping AI hardware current and relevant is becoming a challenge.
• The Evolution of DRAM considers how and why this tried-and-true memory is changing.
• Workload-Specific Hardware Accelerators lays out what differentiates accelerators from other processing elements.
• What’s Different About HBM4 explains how a new DRAM standard aims to solve a critical bottleneck.
• LLMs On The Edge digs into what’s needed to utilize advances in AI in small devices.
• The Road To Super Chips analyzes the challenges in achieving orders of magnitude performance improvements in processors.

Systems And Design

• The Future For Formal Verification asks whether formal specification will be part of the future, or will we continue to see natural language specifications? Will formal successfully break out of just functional verification?
• Multi-Die Verification talks about how to keep everything synchronized in a chiplet-based design.
• Benefits And Challenges Of Using Chiplets investigates coherent vs. non-coherent interfaces, heterogeneous vs. homogeneous, and other considerations with chiplets.
• Inside Chips Podcast: Data Movement In The AI Age is a one-on-one discussion Arteris CEO Charlie Janac about the impact of AI on networks on chip and what will change going forward.
• Accelerating IP Reuse explains how to put 1,000 pieces of IP into a chip design and make sure they work together.
• Optical Interconnectivity At 224 Gbps looks at pros and cons of replacing copper with optical in data-intensive AI systems.
• Speeding Up Die-To-Die Interconnectivity contends that just adding more or thicker wires to a design isn’t sufficient with chiplets.
• Optimizing Data Movement In SoCs And Advanced Packages shows that managing on-chip data is becoming more challenging in the AI era.
• Scenario Coverage In Formal Verification argues that as complexity of designs increases, so does the need for coverage in context.
• Cracking The Memory Wall illustrates how faster data movement can impact overall system performance.
• PCIe Over Optics extols the benefits and tradeoffs of using optics to move data.
• Livelocks And Deadlocks In NoCs advises how to prevent complex systems from freezing up.

Automotive, Security And Enabling Technologies

• Preparing For The Quantum Computing Age discusses designing chips and systems to withstand brute-force attacks by quantum computers.
• Conversing With Your Dishwasher provides insight into how on-device AI can improve interactions with machines.
• Changes In Motor Control examines why motors are becoming quieter, more efficient, and more secure.

Manufacturing, Packaging And Materials

• Six-part series on IC manufacturing:
  • Generative AI In Chip Manufacturing explains how it works, what it can do, and what can go wrong.
  • Advanced Process Control In Semiconductor Manufacturing gives an overview of the past, present, and future of managing wafer processes in the fab.
  • Virtual Metrology In Semiconductor Manufacturing investigates where it works best and why.
  • Using AI For Fault Detection And Classification In Manufacturing weighs supervised vs. unsupervised FDC and its impact on yield.
  • Machine Learning In Semiconductor Manufacturing illustrates how advances and limitations are defined by the data.
  • AI, From A To Z investigates the promise, reality, and evolution of artificial intelligence in semiconductor manufacturing.
• Reliability And Traceability In Advanced Packages dives into the root cause of a failure in a multi-die assembly.
• AI-Driven Collaboration In Chip Manufacturing breaks down how agents can shorten time to market through secure sharing of data by machines.
• Challenges In Testing Photonics In Chips talks about the impact of combining electrical and optical test in a single device.
• Using AI/ML To Find And Correlate IC Test Data pinpoints the root cause of low yield in chip manufacturing.
• Virtual Twins talks about its enormous potential, but also how building them will be a major challenge.
• Advanced Part Average Testing For Chips highlights how unique designs and multi-die assemblies are forcing innovations at the leading edge of testing.
• AI In The IC Equipment Ecosystem discusses how, why, and where LLMs can make a difference in chip manufacturing equipment.
• Big Changes In Medical Electronics highlights how in-field devices will change health care, and what’s needed to make it work.