How to find the root cause of a failure in a multi-die assembly.
The move from planar SoCs to advanced packages can improve performance and provide flexibility in large designs, which are difficult to fit onto a single reticle-sized die. But ensuring the device works as expected remains a challenge. There are multiple packaging options to choose from — 2.5D, fan-out wafer-level packaging, 3D-ICs, and various types of system-in-package — and many possible configurations within those packages. All of this adds to the amount of data that needs to be collected and analyzed. Afkhar Aslam, CEO of yieldWerx, explains how to sort through that data to find the root cause of problems, how different materials and bonding approaches can impact the results, and what else can go wrong along the way.
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