tag: FOWLP

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Copper Electrodeposition For Fan-Out Wafer-Level Packaging
By Lam Research - 16 Jul, 2020 - Comments: 0

As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective way of mixing and connecting various functional technologies. One of the heterogeneous integration platforms gaining increased acceptance is high density fan-out wafer-level packaging (FOWL... » read more

Fan-Out Wafer-Level Packaging And Copper Electrodeposition
By Steven T. Mayer - 21 May, 2020 - Comments: 0

By Steven T. Mayer, Bryan Buckalew, and Kari Thorkelsson As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective way of mixing and connecting various functional technologies. One of the heterogeneous integration platforms gaining increased ac... » read more

Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
By Brewer Science - 14 Aug, 2019 - Comments: 0

Today's fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to achieve lower profile packages without using an inorganic substrate to produce chip packages that are thinner and faster without the need for interposers or through-silicon-vias (TSVs). One approa... » read more

Material Solutions For FOWLP Die Shift And Wafer Warpage
By Shelly Fowler - 20 Jun, 2019 - Comments: 0

By Shelly Fowler Today's fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to achieve lower-profile packages without using an inorganic substrate to produce chip packages that are thinner and faster without the need for interposers or through-silicon-via... » read more

One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material
By Veeco - 22 May, 2019 - Comments: 0

Authors: Warren W. Flack, Robert Hsieh, Ha-Ai Nguyen Ultratech, a division of Veeco 3050 Zanker Road, San Jose, CA 95134 USA wflack@ultratech.com John Slabbekoorn, Samuel Suhard, Andy Miller IMEC Kapeldreef 75 B-3001 Leuven, Belgium John.Slabbekoorn@imec.be Akito Hiro, Romain Ridremont JSR MICRO NV Technologielaan 8 B-3001 Leuven, Belgium akito.hiro@jsrmicro.be Abstract This... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Crossing The Chasm: Uniting SoC And Package Verification
By Tarek Ramadan - 06 Mar, 2017 - Comments: 0

Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, and foundries must collaborate to establish consistent and unified automated WLP design and physical verification flows, while introducing minimum disruption to already-existing package design flows.... » read more

2.5D Surprises And Alternatives
By Ed Sperling - 20 Oct, 2016 - Comments: 0

Semiconductor Engineering sat to discuss advanced packaging issues with Juan Rey, senior director of engineering for Calibre at [getentity id="22017" e_name="Mentor Graphics"]; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon's"] senior director of IP marketing. What follows are excerpts of that conversation. ... » read more

Fan-Out Packaging Gains Steam
By Mark LaPedus - 23 Nov, 2015 - Comments: 1

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

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