tag: Onto Innovation

Photoluminescence Inspection Is Changing How Manufacturers Protect Yield In SiC And GaN Devices
By Jason Lin - 07 Jul, 2026 - Comments: 0

Electric vehicles, fast-charging infrastructure, renewable energy systems, and industrial power conversion are redefining what power semiconductors need to deliver: higher voltages, higher power densities, faster switching, and longer lifetimes. To meet these demands, manufacturers are increasingly turning to wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN). SiC ha... » read more

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging
By Anne Meixner - 07 Jul, 2026 - Comments: 0

Key Takeaways:  To support AI/HPC devices, high-density fan-out on panels must deliver increased RDL layer count and micropillar height while decreasing the trace and bump/micropillar pitch.   Metrology and inspection steps assist with achieving known-good panel requirements to avoid throwing away expensive chiplets, such as HBM and TPUs.  Optical measurement systems need to acco... » read more

Unlocking Scalable SRG Waveguides for Mass‑Market AR/MR Displays
By Onto Innovation - 07 Jul, 2026 - Comments: 0

From consumer products to industrial applications, augmented reality (AR)/mixed reality (MR) technology is one of the most innovative interactive technologies on the market today. By overlaying digital information onto the physical world, AR/MR technology improves how people see, understand, and interact with their environment in real time. The industrial applications alone are cause for celebr... » read more

AI Models Transform Defect Inspection And Review, But Can Fail To Scale
By Laura Peters - 09 Jun, 2026 - Comments: 0

Key Takeaways: AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields. 70% of AI initiatives stall after pilot implementation, but some pitfalls can be avoided. One of the brightest spots in AI use today is the industry’s ability t... » read more

Effective UX/UI Is A Critical Link Between AI Insights And Yield Improvement
By Keira Lai - 09 Jun, 2026 - Comments: 0

The semiconductor industry is undergoing a fundamental shift in how data is generated, analyzed, and acted upon thanks to the integration of AI into process control flows. As AI becomes more deeply integrated into the manufacturing process, its value is increasingly determined not by data-driven decision making alone, but by how effectively its outputs are delivered, interpreted, and acted upon... » read more

Why Analog And Mixed-Signal Chips Resist Adaptive Test
By Gregory Haley - 09 Jun, 2026 - Comments: 0

Key Takeaways Analog and mixed-signal test remains heavily specification-based because the measurements do not always produce a single expected result. The absence of objective coverage metrics has historically encouraged conservative test flows, which IEEE 2427-2025 begins to address. Separating device behavior from test-path variation is a prerequisite for any adaptive flow—and h... » read more

Advancements in Corona Noncontact Metrology Tools, CnCV, for Industrial WBG Wafer Testing and Electrical Defect Related Yield Prediction
By Onto Innovation - 09 Jun, 2026 - Comments: 0

In this review we discuss two recent CnCV metrology advancements, namely: 1. enhancement of throughput and 2. use of electrical defect mapping for yield prediction. Novel 10x faster measurements of critical WBG semiconductor electrical parameters are based on the discovery of a linear UV radiation induced electrical charge biasing.  Example results for an AlGaN/GaN HEMT structure illus... » read more

Moving Defect Detection And Classification To The Edge
By Ed Sperling - 29 May, 2026 - Comments: 0

The number of defects detected through inspection is exploding at each new process node. There are now millions of defects being identified on each wafer, but only a fraction of those can cause problems. Prasad Bachiraju, senior director of business development at Onto Innovation, talks about the different types of images being captured using different illumination modes at different touch poin... » read more

The Specialty Device Surge Part 3: Solving The Process Control Challenges Of MEMS, Photonics, Co-Packaged Optics, And More
By Christopher Haire - 12 May, 2026 - Comments: 0

Every day, consumers rely on an invisible network of specialty semiconductor devices without realizing it. The smartphone in your pocket is a good place to start. It knows when you rotate the screen thanks to MEMS sensors, and its camera delivers crisp images through advanced CMOS image sensors. Meanwhile, fast charging technology, wireless connectivity, facial recognition, and high-frequency c... » read more

Advanced Metrology for Backside Metallization Using Picosecond Laser Ultrasonics
By Onto Innovation - 12 May, 2026 - Comments: 0

Picosecond Ultrasonics (PULSE) Technology has emerged as a leading metrology solution for characterizing single-layer and multilayer metal films in advanced semiconductor manufacturing [1]. As a non-contact, non-destructive technique, PULSE Technology has become the tool-of-record across multiple device segments, including logic, radio frequency (RF), memory, microelectromechanical systems (MEM... » read more

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