Chip Industry Week In Review

By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Achieving Zero Defect Manufacturing Part 1: Detect & Classify

By Prasad Bachiraju - 11 Jun, 2024 - Comments: 0

Whether the discussion is about smart manufacturing or digital transformation, one of the biggest conversations in the semiconductor industry today centers on the tremendous amount of data fabs collect and how they utilize that data. While chip makers are accumulating petabytes of data across the entire semiconductor process, a question arises: how much of that information is being fully uti... » read more

Speeding Up Metrology At Advanced Nodes

By Gregory Haley - 11 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk metrology at the most advanced nodes and the impact of using different substrates, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at Onto Inn... » read more

Advanced FTIR Optical Modeling for Hydrogen Content Measurements in 3D NAND Cell Nitride and Amorphous Carbon Hard Mask

By Onto Innovation - 11 Jun, 2024 - Comments: 0

Abstract Fourier Transform Infrared spectroscopy offers inline solutions for chemical bonding, epi thickness, and trench depth measurements. Through optical modeling of the transmission or reflectance spectra, information about the electronic structure and chemical composition may be obtained, which can be used for process control and monitoring. In this article, we demonstrate the measurement... » read more

3D Metrology Meets Its Match In 3D Chips And Packages

By Laura Peters - 11 Jun, 2024 - Comments: 0

The pace of innovation in 3D device structures and packages is accelerating rapidly, driving the need for precise measurement and control of feature height to ensure these devices are reliable and perform as expected throughout their lifetimes. Expansion along the z axis is already well underway. One need look no further than the staircase-like 3D NAND stacks that rise like skyscrapers to p... » read more

The Race To Glass Substrates

By Gregory Haley - 29 May, 2024 - Comments: 4

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Glass has been discussed as a replacement material for silicon and organic substrates for more than a decade, primarily in multi-die packages. But ... » read more

The Importance Of Secure Data Sharing

By Mike McIntyre - 14 May, 2024 - Comments: 0

When it comes to data accessibility, the terms “secure” and “share” seem like two diametrically opposed words. Conventional wisdom would suggest that any effort to secure data would involve limiting access to that data, while sharing data would involve opening up access to that data for others to view and use. As it turns out, semiconductor operations need to do both. On the one h... » read more

Using Predictive Maintenance To Boost IC Manufacturing Efficiency

By Laura Peters - 14 May, 2024 - Comments: 0

Predicting exactly how and when a process tool is going to fail is a complex task, but it's getting a tad easier with the rollout of smart sensors, standard interfaces, and advanced data analytics. The potential benefits of predictive maintenance are enormous. Higher tool uptime correlates with greater fab efficiency and lower operating costs, so engineers are pursuing multiple routes to boo... » read more

Using Deep Learning ADC For Defect Classification For Automatic Defect Inspection

By Onto Innovation - 14 May, 2024 - Comments: 0

In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is hard to avoid human errors when reviewing millions of defect images every day, and as a result, underkill or overkill of die can occur. Automatic defect classification (ADC) can reduce the number of... » read more

Overlay Optimization In Advanced IC Substrates

By Ed Sperling - 29 Apr, 2024 - Comments: 1

Overlay is becoming a significant problem in the manufacturing of semiconductors, especially in the world of advanced packaging substrates — think panels — the larger the area, the greater the potential for distortion due to warpage. Solving this issue requires more accurate models, better communication through feed forward/feed back throughout the flow, and real-time analytics that are bak... » read more

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