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Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging


The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

Making Test Transparent With Better Data


Data is critical for a variety of processes inside the fab. The challenge is getting enough consistent data from different equipment and then plugging it back into the design, manufacturing, and test flows to quickly improve the process and uncover hard-to-find defective die. Progress is being made. The inspection and test industry is on the cusp of having more dynamic ways to access the dat... » read more

Angstrom-Level Measurements With AFMs


Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Designing Chips For Test Data


Collecting data to determine the health of a chip throughout its lifecycle is becoming necessary as chips are used in more critical applications, but being able to access that data isn't always so simple. It requires moving signals through a complex, sometimes unpredictable, and often hostile environment, which is a daunting challenge under the best of conditions. There is a growing sense of... » read more

Reducing Rework In CMP: An Enhanced Machine Learning-Based Hybrid Metrology Approach


By Vamsi Velidandla, John Hauck, Zhuo Chen, Joshua Frederick, and Zhihui Jiao The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) steps has increased and, with it, a greater need for within-wafer uniformity and wafer-to-wafer control of the thin... » read more

Why Wafer Bumps Are Suddenly So Important


Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing measurement technologies. Bump co-planarity is essentially a measure of flatness. Specifically, it measures the variation in bump height, which may have a target, for example, of about 100 microns. As a ... » read more

Who Owns In-Chip Monitoring Data?


In-chip monitors provide unprecedented visibility into the inner workings of complex integrated circuits for everything from process control to fine binning, preventive system maintenance, and failure analysis. But there may be many consumers of different slices of the data at very different phases of the chip lifecycle, raising questions about who controls and owns all of that data. The ans... » read more

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging


The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

Extremely Large Exposure Field w/Fine Resolution Lithography Tech To Enable Next-Gen Panel Level Advanced Packaging


Abstract—The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device perf... » read more

The Great Quantum Computing Race


Quantum computing is heating up, as a growing number of entities race to benchmark, stabilize, and ultimately commercialize this technology. As of July 2021, a group from China appears to have taken the lead in terms of raw performance, but Google, IBM, Intel and other quantum computer developers aren’t far behind. All of that could change overnight, though. At this point, it's too early t... » read more

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