How in-device monitoring can improve the reliability and lifespan of semiconductors.
How chips are used is changing, and so are the requirements. In the past, markets were largely segmented by application, which determined how chips were designed. High-performance processors went into notebook computers, low-power chipsets were deployed in mobile devices, and complex SoCs and advanced packages were used in data centers. But with the spread of AI everywhere, traditional segmentation no longer applies. Geir Eide, senior director of product management for Tessent Silicon Lifecycle Solutions at Siemens EDA, talks about why monitoring of voltage and temperature is now a requirement across more application areas, how it can be used to identify problems across the design-through-manufacturing flow, and how it can be used to improve the lifespan of expensive chips.
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