New concerns and challenges for memory in AI data centers.
DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, bandwidth, and capacity were the primary considerations. But as the amount of data that needs to be processed, moved, and stored continues to rise, a whole new set of factors is emerging. Steven Woo, fellow and distinguished inventor at Rambus, talks about latency under load, fill frequency, power issues, reliability, and cost considerations, and how all of these factors come together in HBM4 stacks.
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