Industry Road Map Under Construction

By Ed Sperling - 21 Jan, 2016 - Comments: 0

While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

Mobile Market Dynamics Are Changing

By Ed Sperling - 17 Dec, 2015 - Comments: 1

Ever since the introduction of the iPhone in June 2007, increasingly advanced SoCs have dominated the semiconductor supply chain, from tools to design houses to foundries. Android's introduction in 2010 only cemented the market. Together they created massive demand for power-efficient chips that were dark most of the time, feature-rich, and which could respond within milliseconds to any command... » read more

Packaging Wars Ahead

By Ed Sperling - 19 Nov, 2015 - Comments: 0

There has been much talk about semiconductor industry consolidation, but the shift into advanced packaging could have more far-reaching effects than all the mega-deals so far. Packaging is big business. Yole Développement has pinned the market at $30 billion, but that's only a thin slice of the pie that's in play. Companies that win the packaging deals also have a good shot of winning the m... » read more

How Will China Spend $120B?

By Ed Sperling - 22 Oct, 2015 - Comments: 1

It's daunting to consider how much Chinese VC and government money is ready for investment around the globe. With the total now estimated somewhere in the neighborhood of $120 billion, that's a huge stockpile of cash. Just to put that in perspective, roughly $48.3 billion was invested by U.S. investors in 2014, according to a report issued by the National Venture Capital Association and Pricewa... » read more

Raise A Fence, Dig A Tunnel, Build A Bridge

By Ed Sperling - 17 Sep, 2015 - Comments: 0

There are three main options for chipmakers over the course of the next decade. Which option they choose depends upon their individual needs, talents, and how much and what kind of differentiation they believe will matter to them. The options roughly fall into three categories—fence, bridge or tunnel. The fence option Rather than changing anything, the entire ecosystem can stick to wha... » read more

Shrinking R&D Pool

By Ed Sperling - 20 Aug, 2015 - Comments: 2

The rule of thumb in business is that consolidation in a maturing industry improves the health of the surviving companies. In most market sectors that's true. In the semiconductor industry, that formula doesn't work. The reason is due to what might well be called foundational economics. While it's possible to reduce costs in making chips for years to come, at some point the basic building bl... » read more

The Great Imbalance

By Ed Sperling - 23 Jul, 2015 - Comments: 2

The number of options for chipmakers is growing while the number of chipmakers is shrinking. So what does this mean for the semiconductor industry? Short answer: No one is quite sure yet. But a lot more people are beginning to ask that question these days, including investors and analysts. There are a number of factors at play here. To begin with, there are more nodes to choose from than at ... » read more

Not All Scientific Problems Can Be Solved

By Ed Sperling - 18 Jun, 2015 - Comments: 0

In the early part of the 20th century psychologist Karl Lashley set out to locate and study the engram, the memory storage center for the human brain. He never found it. In fact, he ended up disproving the theory that an engram even exists, which was far more important to the understanding of the brain than if he had proven the existence of an engram. The results of more than six decades of ... » read more

What’s After 10nm?

By Ed Sperling - 21 May, 2015 - Comments: 0

Prior to 28nm the semiconductor road map was astoundingly predictable. Every two years you could be assured that features would shrink until there were no more atoms left. Two big things and lots of little things later, the trajectory looks much more uncertain. On the large things side are the obvious culprits—EUV delays, and RC delay caused by thinner wires. This is tough science. Pro... » read more

Big Changes At 10nm And Beyond

By Ed Sperling - 16 Apr, 2015 - Comments: 0

The move to 16/14nm finFETs is relatively straightforward. The move to 10nm and 7nm will be quite different. While double patterning with colors at 16/14nm has a rather steep learning curve, reports from chipmakers developing advanced chips is the technology and methodologies are manageable once engineering teams begin working with it. The hardest part is visualizing how different parts will... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.