category: Power Architect

category: IoT, Security & Automotive

Automotive Electronic Power
By Barry Pangrle - 27 Jul, 2015 - Comments: 2

Nick Hendricks: I was drag racing. I'm a drag racer. Detective Samson: You were drag racing. Nick Hendricks: [nods] Detective Samson: In a Prius. Nick Hendricks: I don't win a lot. —Horrible Bosses (2011) Automobiles are now a platform for multiple electronic devices. From controllers for complex hybrid drive systems like those found in the Toyota Prius to all types of entertainment s... » read more

Asynchronous Design: Is It Time Yet?
By Barry Pangrle - 05 Jun, 2015 - Comments: 0

Non-mainstream technologies can offer advantages over more commonly used approaches, but usually at some additional cost (otherwise they’d probably be mainstream). The additional cost could be in design time, area, testability or whatever, and it might even be only a temporary disadvantage. If comparable time and energy were invested in the new technology, perhaps the additional costs would d... » read more

TSMC Tech Tour De Force
By Barry Pangrle - 13 Apr, 2015 - Comments: 0

TSMC held the first of its three North American Tech Symposiums on April 7 in San Jose, with the other two coming up in Boston on April 14 and in Austin on April 16. As was mentioned previously here, the record fast ramp-time of the 20nm node was highlighted among other technological achievements. TSMC also released its March revenue report on April 10, and it shows a dramatic 49.8% increase in... » read more

TSMC: Rise of the “Phantom Node”
By Barry Pangrle - 23 Mar, 2015 - Comments: 0

TSMC’s financial results for Q4 of 2014 and for the full year were announced in January with TSMC stating it again had achieved record sales and profits. The fourth quarter saw TSMC set records for revenue, earnings per share and cash balance. TSMC made bold predictions last year about 20nm revenue by Q4 2014, and it appears it has met them (see 28nm Powers TSMC Forward, Part Deux). TSMC repo... » read more

An Update On The IEEE 1801-2013 Unified Power Format Standard
By Barry Pangrle - 09 Feb, 2015 - Comments: 0

It’s been almost six years since the first IEEE 1801 standard was officially published in March of 2009, but the standard can trace its roots back to years before that date. On May 30, 2013 the IEEE released a press announcement for the most recent version of the standard, IEEE 1801-2013 (a.k.a. UPF 2.1). This brought forward a standard for the industry that is finally backed by all of the ma... » read more

New Machine Tops The Green500 List
By Barry Pangrle - 10 Dec, 2014 - Comments: 0

The Green500 has released its latest list of the top 500 most energy efficient Supercomputers and there is a new machine, L-CSC from the Helmholtz Center that is the first supercomputer to surpass the 5 GigaFLOPS/watt barrier. The machine is yet another heterogeneous system and is based on AMD FirePro S9150 GPU accelerators and Intel Xeon E5-2690v2 10C 3GHz processors. IBM and NVIDIA aren’... » read more

A Decade At The Ceiling
By Barry Pangrle - 05 Nov, 2014 - Comments: 0

This month marks the tenth anniversary of the introduction of the Intel Pentium 4 HT 570J, which had an advertised operating frequency of 3.8 GHz. It was manufactured in a 90nm process, had a VID voltage range of 1.2V-1.425V and was rated at 115W TDP. In a previous article, Power to Fly, we looked at the graph that I’m including again here below for reference. The microprocessor indu... » read more

Brain-Inspired Power
By Barry Pangrle - 01 Oct, 2014 - Comments: 1

“Let’s be clear: we have not built the brain, or any brain. We have built a computer that is inspired by the brain. The inputs to and outputs of this computer are spikes. Functionally, it transforms a spatio-temporal stream of input spikes into a spatio-temporal stream of output spikes.” — Dharmendra Modha, IBM Fellow It’s generally a well-accepted principle that the biggest savings... » read more

Wireless 3D Stacking
By Barry Pangrle - 18 Aug, 2014 - Comments: 2

Hot Chips 26 wrapped up this week and there were many interesting presentations. One of the many presentations that caught my attention was given by Dave Ditzel, CEO of ThruChip, and is titled, “Low-Cost 3D Chip Stacking with ThruChip Wireless.” The technology is as it sounds — a wireless communication path for stacked die. The first question you may be asking is, ‘Why would anyone w... » read more

GPUs Dominate (Again) The Green500 List
By Barry Pangrle - 16 Jul, 2014 - Comments: 0

The Green500 has released its latest list of the top 500 most energy-efficient Supercomputers. The top 17 are heterogeneous systems (systems that use more than one type of processor), with the top 15 systems all using NVIDIA Kepler K20 GPUs paired with Intel Xeon CPUs. Still at the top of the list is the Tokyo Institute of Technology GSIC Center’s TSUBAME-KFC, an oil-cooled Kepler powered ... » read more

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