category: Power Architect

category: IoT, Security & Automotive

The Power Of eDRAM
By Barry Pangrle - 16 Jun, 2014 - Comments: 1

In last month’s article we looked at different aspects of technology nodes and the multiple techniques that are used to keep scaling on its path of increasing density. From an energy standpoint, it’s expensive to move data around and with the high bandwidth that’s needed to keep processors “fed,” engineers are looking at ways to keep data closer to the processing logic and minimize th... » read more

A Node By Any Other Name
By Barry Pangrle - 12 May, 2014 - Comments: 3

Have you ever wondered what gives a particular CMOS technology node its name? When we talk about 20nm, 16nm or 14nm, what exactly does that number in front of the “nm” mean anyway? Is it the first layer metal half-pitch or the gate length (and while we’re at it, is that the printed gate length, the physical gate length, or the effective gate length)? The half-pitch refers to half the m... » read more

Favorite Forecast Fallacies
By Barry Pangrle - 14 Apr, 2014 - Comments: 0

It’s difficult to make predictions, especially about the future. – An Old Danish Proverb. The GSA Silicon Summit was held on Thursday, April 10th at the Computer History Museum in Mountain View, CA. The opening panel session was entitled Advancements in Nanoscale Processing. The panelists were Rob Aitken (ARM), Adam Brand (Applied Materials), Peter Huang (TSMC), Nick Kepler (VLSI Researc... » read more

The Good Kind Of Regulation
By Barry Pangrle - 13 Mar, 2014 - Comments: 0

This month I’m taking a page from the Editor’s book, (actually the title for the article here came from Ed Sperling) and I decided that the above title would be fitting for this article. Last September we took a look at IBM’s presentations on their POWER8 processor from HotChips. One of the multiple new interesting aspects of this design was the use of many on-chip integrated voltage regu... » read more

28nm Powers TSMC Forward (Part Deux)
By Barry Pangrle - 14 Feb, 2014 - Comments: 0

TSMC’s financial results for the 4th Quarter of 2013 and for the full year were announced just a few weeks ago, with TSMC stating it had again achieved record sales and profits. TSMC continues to own the 28nm foundry market. TSMC a year ago stated plans to have 20nm as its next technology node in production in 2014 and it looks to be delivering on this projected claim with the announcement th... » read more

Making Waves In Low-Power Design
By Barry Pangrle - 16 Jan, 2014 - Comments: 0

Barry Pangrle In a blog last April we looked at a potential candidate technology that just might be able to produce an economically feasible method for implementing delay insensitive circuits in CMOS. The basic idea behind this technology has been around since at least the 1990s and is better known as Null Convention Logic™ (NCL). Much of the work in this area was pioneered by Karl Fant and ... » read more

Fastest Computers On The Planet
By Barry Pangrle - 05 Dec, 2013 - Comments: 0

The latest Green500 list (Excel spreadsheet here) was just released at the end of last month and heterogeneous systems now own the top of the list. The Top 10 systems all use a combination of Intel Xeon (mostly E5) processors paired with NVIDIA K20s. There are now 6 systems listed that have broken the 3,000 MFLOPS/W barrier and TSUBAME-KFC, belonging to the Tokyo Institute of Technology’s GSI... » read more

ARM Cortex-A53, UPF & FD-SOI
By Barry Pangrle - 07 Nov, 2013 - Comments: 0

The IEEE Standards Association Symposium on Electronic Design Automation (EDA) Interoperability was held on Oct. 24. I found the first session, Interoperability Challenges: Power Management in Silicon, with presentations by Erich Marschner of Mentor Graphics and Stuart Riches and Adnan Khan (both from ARM) to be particularly interesting. Earlier this year, the IEEE announced a new version of UP... » read more

Thermals And New Technology Nodes
By Barry Pangrle - 10 Oct, 2013 - Comments: 1

I recently had a friend in EDA ask me about how important thermal analysis is going to be with new FinFET technologies.  I told him that I honestly haven't had too much direct experience with 16nm FinFET yet, but in general, I'd expect thermal analysis to be somewhat more important as feature sizes shrink regardless of whether it's FinFET or planar. Part of my reasoning behind this is that sma... » read more

HotChips: Power8
By Barry Pangrle - 12 Sep, 2013 - Comments: 2

It’s another year, another HotChips Conference and another update on IBM’s POWER processor. IBM continues to impress with its big iron processor, and this year it’s the new POWER8. IBM announced more details of its new POWER8 processor at HotChips and IBM now joins Intel at 22nm, but with the twist that IBM’s process is based on SOI technology. The POWER8 quadruples the thread count ... » read more

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