category: Research

category: IoT, Security & Automotive

Chip Industry Technical Paper Roundup: Apr. 29
By Linda Christensen - 29 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

Research Bits: Apr. 29
By Jesse Allen - 29 Apr, 2025 - Comments: 0

Microchannels for two-phase cooling Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The method utilizes microfluidic channels to create a capillary structure through which coolant flows and a manifold distribution layer that controls the distribution of coolant. The structure enabled two-phase cooling through better managem... » read more

Chip Industry Technical Paper Roundup: Apr. 22
By Linda Christensen - 22 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=421 /] Find more semiconductor research papers here. » read more

Research Bits: April 22
By Jesse Allen - 22 Apr, 2025 - Comments: 0

PIC heterogeneous integration Researchers from Hewlett Packard Labs, Indian Institutes of Technology Madras, Microsoft Research, and University of Michigan built an AI acceleration platform based on heterogeneously integrated photonic ICs. The PIC combines silicon photonics along with III-V compound semiconductors that functionally integrate lasers and optical amplifiers to reduce optical l... » read more

Research Bits: Apr. 15
By Jesse Allen - 15 Apr, 2025 - Comments: 0

Shape-morphing OLED panel with built-in speaker Researchers from Pohang University of Science and Technology (POSTECH) developed a flexible OLED panel that can freely transform its shape while simultaneously functioning as a speaker. The design is based on a based on a specialized ultra-thin piezoelectric polymer actuator that when integrated into a flexible OLED panel enables electrically ... » read more

Research Bits: Apr. 7
By Jesse Allen - 07 Apr, 2025 - Comments: 0

DNA scaffolds for 3D electronics Researchers from Columbia University, Brookhaven National Laboratory, and University of Minnesota used DNA to help create self-assembled 3D electronic devices with nanometer-size features. The team deposited arrays of gold squares on a surface, onto which they could attach short pieces of DNA. These served as anchors to which they could fasten eight-sided di... » read more

Chip Industry Technical Paper Roundup: Apr. 7
By Linda Christensen - 07 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Research Bits: Apr. 1
By Jesse Allen - 01 Apr, 2025 - Comments: 0

Neuro-synaptic RAM Researchers from the National University of Singapore (NUS) and King Abdullah University of Science and Technology (KAUST) found that a standard silicon transistor can function like a biological neuron and synapse when arranged and operated in a specific way. The team was able to replicate both neural firing and synaptic weight changes by adjusting the resistance of the b... » read more

Chip Industry Technical Paper Roundup: Apr. 1
By Linda Christensen - 01 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Research Bits: Mar. 25
By Jesse Allen - 25 Mar, 2025 - Comments: 0

2D materials in 3D transistors Researchers at the University of California Santa Barbara investigated 3D gate-all-around (GAA) transistors made using 2D semiconductors. They considered three different approaches to channel stacking: nano-sheet FETs, nano-fork FETs, and nano-plate FETs. The nano-plate FET architecture, which exploits lateral stacking of 2D layers, was found to maximize the g... » read more

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