category: Research

category: IoT, Security & Automotive

Chip Industry Technical Paper Roundup: June 3
By Linda Christensen - 03 Jun, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=436 /] Find more semiconductor research papers here. » read more

Research Bits: June 3
By Jesse Allen - 03 Jun, 2025 - Comments: 0

Imaging power electronics Researchers from the Institute of Science Tokyo, Harvard University, and Hitachi used diamond quantum sensors to analyze the magnetization response of soft magnetic materials used in power electronics. The method can simultaneously image both the amplitude and phase of AC stray fields over a wide frequency range up to 2.3 MHz. It uses a diamond quantum sensor with ... » read more

Chip Industry Technical Paper Roundup: May 28
By Linda Christensen - 28 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=434 /] Find more semiconductor research papers here. » read more

Research Bits: May 27
By Jesse Allen - 27 May, 2025 - Comments: 0

Tracking ferroelectric domain walls Researchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning oscillator piezoresponse force microscopy to observe how domain walls move in ferroelectric materials under rapidly fluctuating electric fields. “Domain walls can have completely different properties from the neighboring domains they s... » read more

Chip Industry Technical Paper Roundup: May 20
By Linda Christensen - 20 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=432 /] Find more semiconductor research papers here. » read more

Research Bits: May 20
By Jesse Allen - 20 May, 2025 - Comments: 0

Smart t-shirt with sound waves Researchers at ETH Zurich developed a smart textile that uses acoustic waves passed through glass fibers to measure touch, pressure, and movement. The researchers said that using acoustic waves rather than electronics makes measurements more precise with low power consumption and the textiles lighter, more breathable, and easier to wash. It also uses readily avai... » read more

Chip Industry Technical Paper Roundup: May 13
By Linda Christensen - 13 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=430 /] Find more semiconductor research papers here.   » read more

Research Bits: May 13
By Jesse Allen - 13 May, 2025 - Comments: 0

Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

Chip Industry Technical Paper Roundup: May 6
By Linda Christensen - 06 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=427 /] Find more semiconductor research papers here.   » read more

Research Bits: May 6
By Jesse Allen - 06 May, 2025 - Comments: 0

Destroying hydrogen peroxide and triazole Researchers from the University of Technology Sydney and startup Infinite Water International developed catalytic technology that breaks down hydrogen peroxide and triazole, two chemicals used in semiconductor manufacturing for surface cleaning and corrosion prevention. The goal is to create a cleaner wastewater stream that can be reused within the fab... » read more

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