Research Bits: Aug. 13


3D X-ray of chip interiors Researchers from the Paul Scherrer Institute, EPFL Lausanne, ETH Zurich, and the University of Southern California used X-rays to take non-destructive, three-dimensional images of the inside of a microchip at 4 nanometer resolution. To create the images, the researchers relied on a technique called ptychography, in which a computer combines many individual images ... » read more

Research Bits: Aug. 5


Measuring temperature with neutrons Researchers from Osaka University, National Institutes for Quantum Science and Technology, Hokkaido University, Japan Atomic Energy Agency, and Tokamak Energy developed a way to rapidly measure the temperature of electronic components inside a device using neutrons. The technique, called ‘neutron resonance absorption’ (NRA), examines neutrons being ab... » read more

Research Bits: July 30


Embedded thermoelectric devices Researchers from the University of Pittsburgh and Carnegie Mellon University propose using locally embedded thermoelectric devices (TEDs) to perform active cooling inside circuits. “Circuits like clock generators and arithmetic and logic units (ALU) create high-frequency heat fluxes with their peak hot spots occurring on the microprocessor,” said Feng Xio... » read more

Chip Industry Technical Paper Roundup: July 30


New technical papers recently added to Semiconductor Engineering’s library, including a best paper award winner at ISCA. [table id=246 /] More ReadingTechnical Paper Library home » read more

Research Bits: July 22


Sub-1nm gate Researchers from Korea's Institute for Basic Science, Sungkyunkwan University, Harvard University, and Korea Advanced Institute of Science and Technology (KAIST) found a method that enables epitaxial growth of 1D metallic materials with a width of less than 1 nm, which they used as a gate electrode of a miniaturized transistor. The team controlled the crystal structure of molyb... » read more

Chip Industry Technical Paper Roundup: July 22


New technical papers recently added to Semiconductor Engineering’s library. [table id=245 /] More ReadingTechnical Paper Library home » read more

Chip Industry Technical Paper Roundup: July 16


New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home   » read more

Research Bits: July 16


Kirigami-inspired mechanical computer Researchers from North Carolina State University developed a kirigami-inspired mechanical computer that uses a complex structure of rigid, interconnected polymer cubes to store, retrieve, and erase data without relying on electronic components. The system uses 1-centimeter plastic cubes, grouped into functional units consisting of 64 interconnected cubes. ... » read more

Chip Industry Technical Paper Roundup: July 8


New technical papers recently added to Semiconductor Engineering’s library. [table id=238 /] More ReadingTechnical Paper Library home » read more

Chip Industry Technical Paper Roundup: June 25


New technical papers recently added to Semiconductor Engineering’s library. [table id=236 /] More ReadingTechnical Paper Library home » read more

← Older posts Newer posts →